Conductive Contact Point Pin With Segmented Convex Tip
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Solution Overview
Problem
Conventional earth pins struggle to break dense insulating films on semiconductor substrates, leading to inadequate charge dissipation during electron beam irradiation, as they deform rather than break the films, and increasing load risks breaking the substrate.
Innovation Solution
A conductive contact point pin with a tapered tip featuring multiple convex portions that concentrate stress to break through the insulating film and establish electrical connection with the underlying conductive film, preventing substrate damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the load to a conventional earth pin is increased to break the dense insulating film, then the pin can reach the underlying conductive film, but it may break the quartz glass substrate and generate particles
Solution Approach 1:
The pin tip is segmented into multiple convex portions (first, second, and third convex portions with different radii of curvature) instead of a single uniform tip. This segmentation allows stress to be distributed across multiple contact points, enabling the pin to break through the dense insulating film while preventing excessive localized stress that could damage the substrate.
Solution Approach 2:
Different regions of the pin tip have different local properties - the first convex portion has a larger radius of curvature for initial contact and stress distribution, while the second and third convex portions have smaller radii for concentrated stress application to break the film. This local quality variation enables the pin to adapt its interaction with the film layers at different stages.
2Strength
If a dense insulating film is formed on the light shielding film to improve etch resistance, then etch resistance is improved, but the pin cannot break the film to reach the conductive layer
Solution Approach 1:
The pin tip geometry parameters are specifically designed with multiple convex portions having different radii of curvature. This parameter change in the pin structure allows it to apply sufficient stress to break the dense insulating film (which has high etch resistance) without requiring excessive load that would damage the substrate.
3Object-affected harmful factors
If the pin deforms the dense insulating film instead of breaking it, then substrate damage is avoided, but electrical connection to the conductive film is not achieved
Solution Approach 1:
The segmented convex portions create multiple stress concentration points that can collectively break through the dense insulating film. The distribution of these convex portions ensures that the film is broken at multiple locations, creating reliable electrical contact paths without requiring excessive force that would deform or damage the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The pin effectively breaks the insulating film to establish a conductive path, preventing charge accumulation and ensuring precise electron beam patterning without damaging the substrate.
Implementation Method 1
a plurality of convex portions formed in a tip portion of the pin body... breaks, by pressing a substrate where a film to be broken is formed on a conductive film from above the film to be broken, the film to be broken
Data Source
AI summary
A conductive contact point pin includes a pin body, and a plurality of convex portions formed in a tip portion of the pin body, wherein the conductive contact point pin breaks, by pressing a substrate where a film to be broken is formed on a conductive film from above the film to be broken, the film to be broken in order to be electrically connected to the conductive film.