Conductive Edge Polishing Detection Patterns for Substrate Alignment
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Solution Overview
Problem
The existing methods for detecting the edge polishing effect of glass substrates are inaccurate and inefficient, leading to difficulties in aligning and processing in subsequent manufacturing processes due to reliance on human observation.
Innovation Solution
A substrate with conductive edge polishing detection patterns, comprising resistive wires or blocks, is used to measure resistance changes after polishing, providing accurate edge polishing degree data for precise positioning and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If edge polishing detection is performed by naked eye observation, then the detection method is simple, but the measurement precision is poor
Solution Approach 1:
The patent replaces the mechanical/optical naked eye observation system with an electrical resistance measurement system. Conductive patterns are formed on the substrate, and their resistance is measured after polishing to detect edge wear. This substitution of detection mechanism dramatically improves measurement precision while keeping the overall system relatively simple.
Solution Approach 2:
The patent changes the detection parameter from optical (visual appearance) to electrical (resistance). By forming conductive patterns and measuring their resistance after polishing, the system detects edge wear through resistance changes, providing quantitative and precise measurement of polishing quality.
2Productivity
If manual inspection by experienced engineers is used, then the detection method is easy to operate, but the productivity is reduced due to time consumption and rework
Solution Approach 1:
The patent replaces manual visual inspection with automated electrical resistance measurement. This automation eliminates the time-consuming nature of manual inspection, allows for rapid detection of polishing quality, and prevents defective substrates from proceeding to subsequent processes, thereby improving overall productivity.
Solution Approach 2:
The resistance measurement provides immediate feedback on edge polishing quality. By measuring the resistance of conductive patterns after polishing, the system quickly identifies substrates that require rework, enabling timely corrective actions and preventing waste of processing time on defective items.
3Manufacturing precision
If no precise detection method is used, then the manufacturing process is simple, but the manufacturing precision of subsequent processes deteriorates due to alignment difficulties
Solution Approach 1:
The conductive patterns serve multiple functions: they act as both the functional circuit elements of the device and as detection markers for edge polishing quality and positioning. This multi-functionality enables precise alignment in subsequent processes without requiring separate detection and positioning systems, maintaining manufacturing precision while controlling complexity.
Solution Approach 2:
The conductive patterns serve as an intermediary between the polishing process and the measurement system. By incorporating these patterns into the substrate structure, the system enables indirect but precise measurement of edge wear and positioning, facilitating accurate alignment in subsequent manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method offers a more accurate, simple, and cost-effective way to assess edge polishing quality, improving alignment and production efficiency by determining the attrition degree of the substrate edges.
Implementation Method 1
measuring a resistance of each edge polishing detection pattern; and determining, based on the resistance of each edge polishing detection pattern, edge polishing degree data
Data Source
AI summary
A substrate, an edge polishing detection method and device and a positioning method and device for the same, an exposure apparatus and an evaporation device are provided. The substrate includes a base substrate and at least one edge polishing detection pattern on the base substrate. The at least one edge polishing detection pattern is provided at an edge of the base substrate and made of a conductive material.