Edge Grinding Machines TRIZ Cases

Vertical polishing tape alignment prevents oblique edge formation and acute corner breakage during semiconductor substrate fabrication.

Extruding a thermoplastic catheter with a dual-material strip resolves bonding strength versus separation capability contradictions.

A portable sharpener uses adjustable side face guide structures to center and sharpen ice skate blades of varying thicknesses.

Mirror-finishing chamfer polishing prevents edge roll-off on semiconductor wafers using a two-stage abrasive-free solution and differentiated polishing pads.

A turning wheel with abrasive particles polishes flexible tubular workpieces using magnetic attraction to hold the surface during rotation.

A finisher arrangement integrates a shared swing arm mechanism to vertically position the hopper and bowl for material transfer.

A transverse grinding belt system guides abrasive motion diagonally across metal workpieces, eliminating uneven roller wear and inferior surface quality.

Segmented grinding disc set distributes workload across specialized cup and oscillating units, reducing excessive wear from linear contact zones.

Cycloidal trajectory motion distributes grinding forces uniformly across wafer surfaces, eliminating convex thickness profiles and edge roll-off defects.

Sealed enclosure and water bath filtration remove harmful dust from welding electrode grinding, ensuring operator safety.

Negative pressure suction draws cooling fluid into internal channels, eliminating waste from traditional spray methods.

A rotating cylinder assembly uses internal and external bristles to frictionally engage pipe surfaces for simultaneous de-burring.

Reducing release sheet roughness to 0.1 μm maximizes adhesive contact, preventing axial deviation during edging.

Reducing refrigerant flow during standby prevents excessive cooling, eliminating dummy polishing and maintaining stock removal rates.

A convexly curved glass edge surface featuring longitudinal furrows reduces stress intensity at crack ends.

A hydrodynamic bearing uses shell support weakening to enable elastic deformation for stable lubricant film maintenance.

A follow-on pin transfers a gemstone using viscoplastic adhesive bonding to maintain precise coordinate systems.

Apparatus acquires machining details and period of time to generate status information, resolving reliance on guesswork for usage state.

A rotary polishing tool uses a tooth-and-slot system to lock the pad onto the drive plate.

Chamfered surfaces with controlled gradients prevent submicron particle accumulation on rectangular glass substrates.

Dual arm pair rotates substrate upside down around a common axis, eliminating temporary mounting tables and reducing apparatus size.

A measurement device combines optical and probe units to acquire rim shape data.

Integrated spray nozzles and a soft retaining ring component remove bevel residue particles before main polishing, preventing wafer scratches.

A substrate with conductive edge polishing detection patterns measures resistance changes to determine attrition degree.

Inclined machining tool creates a quasi-conical rear bevel foot to eliminate mechanical interference between the lens edge and strongly cambered frames.

Automated adhesive tape sticking system coordinates movement units to apply and separate tape from processing cups.

An encoded memory mark on an ophthalmic lens enables automated data decoding via image acquisition, eliminating manual entry errors during lens preparation.

Grinding substrate edges into curved surfaces reinforces thin display panels, preventing cracks caused by reduced thickness.

Segmenting the measurement system into multiple radial sensors captures non-parallel gap geometry, eliminating errors from single-point readings.

A multifunctional wheel burr removing device synchronously clamps and rotates aluminum alloy wheels to remove surface defects.

Movable guides adjust station spacing to process endless belts of different lengths, eliminating visible weld seams on high-quality surfaces.

Rotating abrasive tools trim protruding plastics film from photovoltaic module edges, replacing manual methods to reduce cycle times.

Independent dresser head rotation eliminates complex transmission mechanisms and reduces manufacturing costs.

Radial annular nozzle directs hydraulic fluid toward the tool, resolving insufficient cooling while maintaining precise surface guidance.

Current regulator reduces actuator current when movement direction deviates, preventing tool overload during optical lens centring grinding.

A magnetic leap block mounting mechanism secures optical components using elastic force and wire-driven lifting.

A single chamber substrate treating apparatus integrates polishing and cleaning units to process wafers sequentially.

A vibratory finishing machine adjusts the gap width between its rotary table and work container using compressed air pressure to establish a precise zero reference.

Periodic reciprocating rotation maintains high relative velocity between the workpiece and granular material, preventing velocity gradients in complex cavities.

A glass sheet processing tool uses a dashpot buffering element to absorb impact forces from microscopic edge projections.

Curved surface with axial protrusion generates vortices to reduce steam leak loss despite thermal expansion.

Through holes in the blade mount reduce radial rigidity, enabling high amplitude vibration transmission for cutting hard brittle materials.

Controlled magnetic fields applied during slider lapping prevent temperature-induced magnetic moment disordering in read head components.

Symmetric circular base dissipates heat radially to reduce thermal deformation errors in high-precision cutter grinding.

An adjustable tray apparatus supports stone tiles during on-site edge profiling and polishing operations.

Annealing removes residual stress from sliced wafers, enabling resin-mounted grinding that suppresses warp and achieves high flatness.

A processing unit detects lens patterns and selects a subset to deduce the centering point position.

A cam and follower drive mechanism rotates the blade along a longitudinal path to maintain the predetermined angular measure during sharpening.

A shaft alignment device displays full lens images alongside enlarged views of specific areas to detect hidden and printed marks.

A multi-holder fixture secures and rotates cannulas simultaneously during grinding operations.