Integrated Substrate Polishing and Cleaning Apparatus
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Solution Overview
Problem
In semiconductor manufacturing, the uneven surface of wafers due to multi-layer structures and fine circuit patterns leads to defocusing issues and contamination, necessitating both polishing and cleaning processes to ensure device quality and yield.
Innovation Solution
A single-type substrate treating apparatus and method that integrates polishing and cleaning processes in a single chamber, utilizing a polishing unit with a rotating and movable polishing head, a cleaning unit with supersonic cleaning, and a pad conditioning unit to maintain polishing pad surface roughness, allowing for simultaneous chemical and mechanical polishing and cleaning of substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate polishing and cleaning processes are used, then each process can be optimized independently, but the manufacturing time and process complexity increase
Solution Approach 1:
The patent combines the polishing process and cleaning process into a single integrated apparatus and method. The polishing unit with rotating polishing pad and the cleaning unit with spray nozzles are integrated in one system, allowing both processes to be performed sequentially on the substrate without removing it from the chamber, thereby reducing manufacturing time while maintaining surface flatness quality
Solution Approach 2:
The substrate support unit serves multiple functions: it holds the substrate during polishing, rotates the substrate for uniform treatment, and positions the substrate for cleaning. This multi-functional design enables the system to perform both polishing and cleaning operations without requiring separate dedicated equipment for each process
2Manufacturing precision
If multiple processes are performed in sequence, then each process can be optimized, but the device complexity increases
Solution Approach 1:
The patent merges the polishing apparatus and cleaning apparatus into a single integrated system. The polishing unit includes a rotating polishing pad while the cleaning unit includes spray nozzles, and both are controlled from a single apparatus, simplifying the overall system architecture compared to using separate independent processes
3Manufacturing precision
If conventional polishing is used, then surface flatness can be improved, but contaminants remain on the substrate surface
Solution Approach 1:
The cleaning process is performed immediately after polishing while the substrate is still in the polishing chamber. The spray nozzles apply cleaning solution to the substrate surface right after polishing, removing contaminants before the substrate is transferred to another chamber, ensuring both flatness and cleanliness in a single integrated process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integrated approach effectively planarizes the substrate surface and removes contaminants, enhancing the quality and yield of semiconductor devices by performing polishing and cleaning in a single process chamber, thereby improving the flatness and cleanliness of substrates.
Implementation Method 1
A CMP apparatus is used to polish the surface of a wafer coated with tungsten or an oxide by using mechanical friction and chemical abrasives
Implementation Method 2
A CMP apparatus is used to polish the surface of a wafer coated with tungsten or an oxide by using mechanical friction and chemical abrasives
Implementation Method 3
a bellows which can be extended by air pressure; means for bringing the polishing pad into tight contact with a surface of a substrate by extending the bellows
Implementation Method 4
the polishing pad holder may include a magnet member configured to exert a magnetic force to the metal plate such that the other side of the metal plate may be detachably attached to the polishing pad holder
Data Source
AI summary
Provided are a single type substrate treating apparatus and method. A polishing unit is disposed in a process chamber for polishing a substrate chemically and mechanically, and a cleaning unit is disposed in the same process chamber for cleaning the substrate. Therefore, according to the single substrate treating apparatus and method, a polishing process and a cleaning process can be performed on a substrate in the same process chamber by a single substrate treating method in which substrates are treated one by one.