Conductive Foam Cooling for Conformal DIMM Heat Removal
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Solution Overview
Problem
Existing cooling systems for high heat-generating components in Information Handling Systems (IHS) face challenges due to limited form factor, density, and serviceability, leading to inefficiencies in heat dissipation and increased power consumption, particularly in cooling Dual Inline Memory Modules (DIMMs) and similar electronic devices.
Innovation Solution
A thermally conductive foam system is used that conforms to the shape of components, incorporating a coolant pipe to absorb and transfer heat effectively, with the foam block having a contour matching the component's shape and being deformable for easy removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a passive cooling system with airflow is used, then heat rejection is achieved, but power consumption increases due to fans and blowers
Solution Approach 1:
The patent replaces the mechanical airflow system (fans and blowers) with a thermal conduction-based cooling system. The foam material conducts heat away from the component directly to the coolant pipe, eliminating the need for mechanical air movers and their associated power consumption while maintaining effective heat rejection.
Solution Approach 2:
The foam material serves as a thermal intermediary between the heat-generating component and the coolant pipe. It conducts heat from the component surface through its structure to the coolant pipe, enabling efficient heat transfer without requiring direct thermal contact or mechanical airflow systems.
2Adaptability or versatility
If a rigid cooling plate is used, then heat transfer is effective, but adaptability to component shapes is poor
Solution Approach 1:
The patent employs a flexible foam material that can deform and conform to the specific shape of the electronic component. This flexibility allows the cooling system to adapt to various component geometries while maintaining continuous thermal contact, ensuring effective heat transfer without the need for rigid plates or complex machining.
Solution Approach 2:
The foam material's physical parameters (such as cell structure and density) are designed to provide optimal thermal conductivity while maintaining flexibility. The material can be adjusted in its physical properties to balance conformability and heat transfer efficiency for different application scenarios.
3Ease of operation
If thermal paste is used between component and heat sink, then thermal contact is improved, but serviceability and ease of removal are reduced
Solution Approach 1:
The patent extracts and eliminates the thermal paste layer from the cooling system. Instead of relying on a thin layer of paste to establish thermal contact, the foam material provides its own thermal conduction path directly from the component to the coolant pipe, removing the need for separate thermal interface materials and simplifying the system for easier service and removal.
Solution Approach 2:
The foam material serves as a composite solution that combines the functions of thermal interface material and heat conduction medium. Its cellular structure provides both thermal conductivity and mechanical compliance, eliminating the need for separate thermal paste while maintaining effective thermal contact and facilitating easy removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides effective heat transfer and management, maintaining component temperatures within safe limits while reducing fan usage and power consumption, as demonstrated by simulation results showing maximum DRAM temperatures below critical thresholds.
Implementation Method 1
the foam block is thermally conductive to convey heat from the electrical component to the coolant fluid
Implementation Method 2
a coolant pipe is immersed within the foam block. The coolant pipe is configured to pass a coolant fluid through the foam block
Data Source
AI summary
Systems and methods are provided for component cooling using a thermally conductive foam that conforms to the shape of components on the electronic devices while providing adequate movement of heat away from their components. According to one embodiment, a thermally conductive foam cooling system includes a coolant pipe immersed in a foam block. The foam block has a surface with a contour that matches the contour of an electrical component. The coolant pipe is configured to pass a coolant fluid through the foam block, while the foam block is thermally conductive to convey heat from the electrical component to the coolant fluid.