Conductive Frame EMI Shielding and Thermal Dissipation in Semiconductor Packages
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Solution Overview
Problem
Semiconductor device packages face challenges with electromagnetic interference (EMI) and heat dissipation, particularly as they become miniaturized and layout density increases.
Innovation Solution
A semiconductor device package is designed with a conductive frame that includes leads and a molding layer, where the conductive frame is electrically connected to the electronic device and configured as a conformal shield to reduce EMI, and also serves as a heat dissipation path, with the molding layer encapsulating the device and conductive frame to enhance structural robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor device package is miniaturized and layout density is increased, then the device size is reduced and integration is improved, but electromagnetic interference (EMI) increases and heat dissipation becomes more difficult
Solution Approach 1:
A conductive frame is introduced as an intermediary component between the electronic device and the external environment. The frame includes a ground electrode that acts as a shield to block electromagnetic interference from reaching the electronic device, while also providing a thermal conduction path for heat dissipation.
Solution Approach 2:
The molding layer undergoes a phase transition from a liquid molding compound to a solid encapsulated structure. This phase change allows the molding compound to flow into and fill the spaces between the conductive frame and electronic device, then solidifies to provide structural support and electrical insulation while maintaining the conductive frame's EMI shielding and thermal management functions.
2Volume of moving object
If the semiconductor device package is miniaturized, then the device size is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The conductive frame serves as a thermal intermediary, conducting heat away from the electronic device through its ground electrode and lateral portions. The frame's conductive material provides a dedicated thermal pathway that is independent of the device's miniaturized dimensions.
Solution Approach 2:
The conductive frame performs multiple functions simultaneously: it provides electromagnetic interference shielding through its ground electrode, facilitates heat dissipation through its conductive structure, and offers mechanical support. This multi-functionality allows effective thermal management in miniaturized packages without requiring separate dedicated cooling components.
3Object-affected harmful factors
If the conductive frame is added for EMI shielding and heat dissipation, then EMI reduction and thermal management are improved, but device complexity increases
Solution Approach 1:
The conductive frame is designed as a multi-functional component that simultaneously provides EMI shielding through its ground electrode, heat dissipation through its conductive pathways, and mechanical support. By combining multiple functions into a single integrated structure, the overall device complexity is minimized compared to using separate components for each function.
Solution Approach 2:
The ground electrode and lateral portions of the conductive frame are merged into a single continuous conductive structure. This integration allows the frame to provide both EMI shielding and thermal management functions through one unified component rather than requiring separate shield and heat sink elements.
4Object-affected harmful factors
If the molding layer is formed between adjacent leads, then EMI shielding is improved, but manufacturing precision requirements increase
Solution Approach 1:
The conductive frame is pre-formed with defined lateral portions and notches before the molding process. These pre-defined structural features serve as guides that automatically position the molding layer correctly between the leads during encapsulation, reducing the need for high-precision positioning control during manufacturing.
Solution Approach 2:
The molding layer is applied as a flexible molding compound that can flow into the spaces between the conductive frame's lateral portions and leads. This flexible application method allows the molding material to conform to the existing structure rather than requiring precise pre-positioning, thereby reducing manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI and improves heat dissipation, enhancing the reliability and robustness of the semiconductor device package while maintaining compatibility with wafer level chip scale packages and allowing for system-in-package configurations.
Implementation Method 1
the conductive frame is electrically connected to the electronic device and configured as a conformal shield to reduce EMI
Implementation Method 2
the conductive frame... serves as a heat dissipation path
Data Source
AI summary
A semiconductor device package includes an electronic device, a conductive frame and a first molding layer. The conductive frame is disposed over and electrically connected to the electronic device, and the conductive frame includes a plurality of leads. The first molding layer covers the electronic device and a portion of the conductive frame, and is disposed between at least two adjacent ones of the leads.