Conductive Glue Electrode Assembly for Thermal Bending Resistance
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Solution Overview
Problem
Existing electronic devices face challenges in durability due to the use of conductive tape requiring high precision in manufacturing, which is unfavorable for automation, and metal components prone to bending under hot and cold impacts.
Innovation Solution
An electronic device design featuring a substrate with a first electrode layer, conductive and insulating glues, and metal elements fixed using a configuration where the conductive glues are separated by insulating glue, enhancing durability by preventing bending during temperature changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive tape is used to fix and electrically connect electronic components, then electrical connection is achieved, but manufacturing precision requirements increase and automation becomes difficult
Solution Approach 1:
The patent replaces the mechanical/conductive tape-based connection system with a glue-based fixation system. The conductive glue serves dual purposes: mechanical fixation and electrical connection, eliminating the need for separate conductive tape and reducing precision requirements for alignment and positioning, thereby enabling automation.
2Reliability
If metal components are used in electronic devices, then electrical conductivity is improved, but the components are prone to bending under hot and cold impact
Solution Approach 1:
The patent uses composite material structures where metal components are combined with insulating glue and conductive glue. The glue layers act as thermal insulation and stress distribution media, preventing direct thermal shock to the metal components and reducing bending deformation while maintaining electrical conductivity through the conductive glue paths.
Solution Approach 2:
The patent changes the thermal parameters of the overall structure by introducing glue layers with different thermal expansion coefficients and thermal conductivity than the metal components. This creates a composite structure that can better accommodate thermal stress and prevents excessive bending under hot and cold impact.
3Reliability
If high precision manufacturing is used to ensure proper alignment of components, then connection reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent employs glue as a forgiving, flexible connection medium that can accommodate minor misalignments. The conductive glue creates electrical pathways that are tolerant to position variations, eliminating the need for high-precision alignment mechanisms and reducing manufacturing complexity while maintaining connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves durability by preventing metal elements from bending under thermal stress, thereby enhancing automation efficiency and product reliability.
Implementation Method 1
a first conductive glue disposed on the substrate and in the peripheral region; a second conductive glue disposed on the substrate and in the peripheral region; an insulating glue disposed in the peripheral region and overlapped with the first conductive glue and the second conductive glue
Data Source
AI summary
An electronic device including an active region and a peripheral region, and includes: a substrate including a first border extending along a first direction; a first electrode layer disposed on the substrate; a first conductive glue and a second conductive glue disposed in the peripheral region; an insulating glue overlapped with the first conductive glue and the second conductive glue; a first element fixed on the first electrode layer through the first conductive glue and the insulating glue; and a second element fixed on the first electrode layer through the second conductive glue and the insulating glue; wherein the first conductive glue and the second conductive glue are separated by a space, and the insulating glue at least partially overlaps the space; a sum of lengths of the first conductive glue and the second conductive glue is less than a length of the insulating glue.