Printed Circuits Structural Associations TRIZ Cases

Relocating the magnetic sensor to the counterweight cuts heat and magnetic interference errors for faster, more precise lens control.

A bracketed FPC stack secures BTB connectors in tight PCB layouts, cutting screws, simplifying assembly, and improving space use.

A spacer keeps parallel circuit boards separated inside an aerosol power unit, preventing shorts while preserving compact assembly.

Common-mode voltages on differential links assign unique peripheral IDs without jumpers or dedicated wires, cutting interface complexity and cost.

Alternating waterfall coolant flow and vertical partitions improve heat transfer and stable cooling in vertically mounted GPU processors.

An elastic cantilever support keeps a camera module aligned with the optical hole while reducing FPCB-induced tilting, lifting, and assembly complexity.

Common-mode voltages on differential links assign unique peripheral identifiers without jumpers or dedicated wires, cutting wiring and manufacturing overhead.

Separated conductive glues overlapped by insulating glue stabilize metal-to-electrode bonding under thermal stress and simplify automated assembly.

A layered connection pad with cover layer and via-linked pads blocks moisture and contaminants while preserving display electrical contact.

Separating switching circuitry onto a thermally conductive second board improves heat dissipation and modular flexibility in induction cooktops.

Separating switching circuitry onto a thermally conductive second PCB improves heat dissipation, protects control electronics, and supports modular cooktop layouts.

A peripheral glue layout overlaps conductive adhesives to limit metal bending under thermal stress and improve device durability.

Stacked flexible printed circuits use integrated brackets and fewer fasteners to simplify BTB connector assembly and improve PCB space use.

This case uses a recessed sealant region and filler particles to enlarge substrate contact and reinforce thin-device bonding.

Island-and-strip flexible substrates with elastic members protect lines and maintain sensor alignment and precision during deformation.

A vertical intermediate PCB separates chip-to-chip signals from power circuits, reducing routing density and supporting higher speeds.

A notched rigid board accommodates the extended cover layer, improving surface flatness and reducing delamination risk during lamination.

A SIM card enclosure features a structural protrusion that provides a mechanical grip point for manual extraction.

A hardware plane uses orthogonal minor planes to create gaps for cooling air flow across connected cards.

A rigid-flexible printed circuit board manufacturing method uses segmented lamination to join flexible substrates with bonding sheets.

Integrating driver ICs and flexible circuits onto one board thins the rear region, eliminating bulky wiring boards that increase weight and assembly complexity.

Overlapping spare wires reroute signals around broken display paths, reducing trace resistance and preventing edge-rounding in larger liquid crystal displays.

Vertical signal transmission in a three-layer power module reduces parasitic resistance and conduction loss by minimizing horizontal trace paths.

Segmented rigid and flexible circuit boards route through available volume, resolving space utilization constraints without increasing manufacturing complexity.

Segmented pressing with PTFE spacers and polyetherimide films protects solder-resist layers from damage during manufacturing.

A transceiver circuit forwards wakeup signals between serially chained devices using a multistream generator to encode data into packets.

A dual interface data storage apparatus uses a movable carriage to extend or retract connection ports within a protective housing.

Staggered terminal arrangement guides correct cable connection order in trailer maneuvering drive central units.

A sandwich package structure holds electronic elements within a middle frame and protective caps.

Segmenting the PCB into stacked mounting substrates connected by flexible films reduces plane space occupied by integrated ICs.

Dual-resin cover films reduce flexible printed circuit board thickness while maintaining conductive pattern coating reliability.

A rigid membrane supports a flexible circuit board bending portion to disperse resilience force, preventing press marks on the secondary display panel.

A phase change material fills the internal space between stacked circuit boards to absorb heat generated by circuit elements.

Fold flexible printed circuit input terminals to reduce liquid ejection head width, resolving the trade-off between downsizing and manufacturing complexity.

Segmented flexible printed circuit boards with varying bend radii suppress shearing forces at joining portions while collecting interface terminals.

Flexible connections route high-density wires between rigid platforms and panels, reducing wiring complexity while enabling three-dimensional structures.

Elastic hinges fold a chip card body to match USB connector dimensions, resolving thickness mismatch and contact reliability issues.

A vehicle lidar apparatus uses a one-dimensional MEMS mirror to arrange optical components in a compact linear configuration.

A flexible display apparatus mounts touch and display drive signal lines on separate substrates to prevent mechanical failure.

A flexible circuit board merges multiple conductive pattern parts onto a single substrate to enable direct chip mounting.