Rigid-Flex PCB Notch Structure for Lamination Flatness

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Solution Overview

Problem

The uneven outer surface of rigid-flexible PCBs due to the extended cover layer during lamination affects performance and reliability.

Innovation Solution

A rigid board with notches is laminated to a flexible board, with insulating and conductive layers, and protective layers are applied to maintain flatness and protect against delamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the cover layer extends toward the rigid area to prevent separation, then the protective function is improved, but the outer surface becomes uneven

Engineering Contradiction:
Improveprotective functionVSAvoidouter surface flatness
Core Design Contradiction:
ReliabilityVSShape

Solution Approach 1:

The rigid board is segmented by creating a notch that divides its structure into regions that can accommodate the extended cover layer. This segmentation allows the cover layer to extend toward the rigid area for protection while the notch absorbs the volume difference, maintaining the outer surface flatness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The extended cover layer is nested within the notch of the rigid board structure. The notch acts as a recessed space that contains the extended portion of the cover layer, allowing it to provide protection without protruding and creating surface unevenness.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If the cover layer extends toward the rigid area, then delamination is prevented, but manufacturing complexity increases

Engineering Contradiction:
Improvedelamination resistanceVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The rigid board is segmented by creating a notch that divides its structure into regions that can accommodate the extended cover layer. This segmentation allows the cover layer to extend toward the rigid area for protection while the notch absorbs the volume difference, maintaining the outer surface flatness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The notch is pre-formed in the rigid board before the cover layer is applied and extended. This preliminary action prepares the structure in advance to receive and accommodate the extended cover layer, simplifying the subsequent lamination process and reducing manufacturing complexity.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20250220825A1Rigid-flexible printed circuit board and preparation methond therefor
Publication Date: 2025.07.03 TRIPLE WIN TECH (SHENZHEN) CO LTD
  • US20250220825A1 patent drawing
  • US20250220825A1 patent drawing
  • US20250220825A1 patent drawing

AI summary

A preparation method for a rigid-flexible printed circuit board involves initially providing a flexible board, divided into two regions along its extension direction. A first protective layer is applied to the flexible board, with distinct parts covering the two regions respectively. Subsequently, a rigid board is positioned in the second region, designed with a notch to alleviate height discrepancies introduced by the protective layer. The final step involves laminating the rigid board to the flexible board. This ensures the portion of the rigid board adjacent to the second portion is aligned flush with the rest, resulting in a rigid-flex PCB with improved flatness. This method is particularly significant for applications requiring precise structural integrity and consistency in electronic devices.