Rigid-Flexible PCB Manufacturing via Segmented Lamination
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Solution Overview
Problem
Current methods for manufacturing rigid-flexible printed circuit boards (PCBs) face challenges in efficiently integrating flexible and rigid portions while ensuring reliable electrical connectivity and mechanical flexibility, which affects the assembly and mounting of electronic components.
Innovation Solution
A method involving the use of bonding sheets, prepreg sheets, and conductive layers to laminate and separate flexible PCBs, forming a rigid-flexible PCB with defined mounting portions for electrical connectivity, and allowing for flexible angles to facilitate component mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple flexible PCBs are laminated together with bonding sheets to form rigid-flexible PCB, then structural integrity and electrical connectivity are improved, but manufacturing complexity and process difficulty increase
Solution Approach 1:
The manufacturing process is divided into distinct stages: preparing individual flexible PCBs with copper foils, laminating them with bonding sheets and prepreg sheets, forming separate conductive layers, and finally assembling the rigid-flexible PCB. This segmentation allows each stage to be optimized independently, reducing overall manufacturing complexity while ensuring reliable electrical connectivity through controlled lamination and conductive layer formation.
Solution Approach 2:
Bonding sheets and prepreg sheets are introduced as intermediary materials between flexible PCBs during lamination. These intermediaries facilitate controlled adhesion and electrical connectivity while managing the complexity of bonding multiple flexible PCBs together, ensuring reliable assembly without requiring direct complex bonding between all components.
2Strength
If flexible PCBs are laminated with bonding sheets and prepreg sheets to create rigid portions, then mechanical strength is improved, but flexibility and ease of assembly are reduced
Solution Approach 1:
The rigid-flexible PCB structure implements local quality by creating rigid portions through lamination of flexible PCBs with bonding sheets and prepreg sheets in specific areas, while maintaining flexible portions that remain unlaminated. This allows the PCB to have both mechanical strength where needed and flexibility where required, facilitating ease of assembly in mounting portions without compromising overall structural integrity.
Solution Approach 2:
The flexible PCB is divided into distinct rigid portions and flexible portions through selective lamination. Rigid portions are created by laminating with bonding sheets and prepreg sheets, while flexible portions remain unlaminated to maintain bendability. This segmentation enables the PCB to achieve mechanical strength in critical areas while preserving flexibility and ease of assembly in mounting areas.
3Reliability
If conductive layers are formed on flexible PCBs before lamination, then electrical connectivity is ensured, but manufacturing precision requirements increase
Solution Approach 1:
Conductive layers are formed on the flexible PCBs before the lamination process. This preliminary action ensures that electrical connectivity patterns are established in advance, allowing for proper alignment and bonding during subsequent lamination steps. By preparing conductive layers beforehand, the manufacturing process can maintain electrical connectivity reliability while managing alignment precision through controlled lamination procedures.
Data Source
AI summary
A rigid-flexible printed circuit board (PCB) a method for manufacturing the rigid-flexible PCB, and a PCB module having the rigid-flexible PCB are provided. The rigid-flexible printed circuit board (PCB) defines a first area, a second area, and a third area connected in the described order. The rigid-flexible PCB includes a first flexible PCB, a second flexible PCB adhered with the first flexible PCB through a bonding sheet in the third area, and, a first conductive layer and a second conductive layer formed on opposite side of the rigid-flexible PCB in the first area and the third area. The first flexible PCB is apart from the second flexible PCB in the first area and the second area.