Hardware Plane With Orthogonal Minor Planes For Cooling Airflow
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Solution Overview
Problem
Existing hardware plane designs hinder efficient air flow around interconnected hardware components, leading to increased heat generation and potential equipment failures, while also complicating the layout to minimize wire overlap sites and accommodate multiple hardware cards.
Innovation Solution
A hardware plane design featuring a major plane with orthogonal minor planes and strategically positioned connectors and buses, including gaps for improved airflow, which minimizes wire overlap sites without compromising the ability to interconnect multiple hardware cards efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If fans are positioned to direct air orthogonally towards the major surfaces of the hardware plane, then the cooling air flow is simplified, but the air flow is physically impeded by the hardware plane surface itself resulting in less effective cooling
Solution Approach 1:
The patent introduces a third dimension for air flow by creating gaps between minor planes that allow air to flow through the hardware plane structure rather than just across its surface. This dimensional change enables air to bypass the impeding surface while maintaining simple orthogonal fan positioning.
Solution Approach 2:
The hardware plane is segmented into multiple minor planes with gaps between them, creating a structured configuration that allows air flow paths through the assembly. This segmentation maintains the overall planar structure while enabling effective cooling air flow.
2Temperature
If fans are positioned to direct air across the major surfaces of the hardware plane, then cooling effectiveness is improved, but extra lateral space inside the computer system is required to accommodate the fan
Solution Approach 1:
The patent enables air flow through the vertical/thickness dimension by creating gaps between minor planes, allowing orthogonal fan positioning to achieve effective cooling without requiring lateral space expansion. This transforms the cooling approach from surface-level to volumetric air flow.
3Reliability
If layers are added to the hardware plane to prevent wire intersections, then wire overlap sites are eliminated, but the hardware plane becomes thicker, more complicated, and more expensive
Solution Approach 1:
The patent employs asymmetric routing of data and control buses, positioning them on different sides of the hardware plane or in non-intersecting paths. This asymmetric layout prevents wire intersections without requiring additional layers, thereby reducing complexity while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances cooling airflow, reduces heat buildup, and maintains a cost-effective, space-efficient configuration that allows for effective communication and connectivity among hardware cards.
Implementation Method 1
A common solution for reducing the generated heat is to use fans to move cooling air around the hardware plane and the hardware cards
Data Source
AI summary
A hardware plane providing improved cooling air flow is disclosed herein. The hardware plane includes one or more minor planes extending from a major plane so that a gap or opening is formed for air flow. A cooling unit moves air through the gap and across the surface of hardware cards connected to the hardware plane in order to cool the hardware plane and the hardware cards. The hardware plane allows for both improved cooling air flow and for space-efficient and cost-efficient positioning of hardware cards, data buses, and control buses.