Modular Induction Cooktop Circuit Board for Switching Heat Dissipation
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Solution Overview
Problem
Existing induction cooktops face challenges in efficiently managing heat dissipation from high-frequency switching circuitry, which can lead to thermal damage and limit modular design flexibility.
Innovation Solution
A modular circuit board assembly is implemented, comprising a first circuit board with control and power circuitry and a second circuit board with switching circuitry, where the second board is constructed from thermally conductive materials to dissipate heat effectively, while maintaining electrical efficiency and allowing for various spatial configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If switching circuitry is integrated on the same circuit board as control and power circuitry, then device complexity is reduced, but heat dissipation becomes difficult to manage effectively
Solution Approach 1:
The circuit board is divided into separate modules: a first circuit board containing control and power circuitry, and a second circuit board containing switching circuitry. This segmentation allows each module to be optimized independently, with the second board specifically designed for thermal management of high-power switching components while the first board handles control functions.
Solution Approach 2:
The switching circuitry is extracted from the first circuit board and placed on a separate second circuit board. This extraction removes the heat-generating switching components from the control circuit board, enabling effective thermal management while maintaining functional integration through electrical connections between the two boards.
2Temperature
If switching circuitry is separated onto a second circuit board, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The first and second circuit boards are rigidly connected to form a unified modular assembly that functions as a single integrated unit. This merging approach maintains the benefits of separation for thermal management while presenting a compact, unified structure that reduces overall system complexity despite the internal modular architecture.
Solution Approach 2:
The modular circuit board assembly is designed to be universally applicable across different induction cooktop configurations and power levels. The standardized connection interface and modular design allow the same assembly structure to serve multiple functions and applications, reducing design complexity for different scenarios.
3Temperature
If the second circuit board uses thermally conductive materials, then heat dissipation improves, but manufacturing cost increases
Solution Approach 1:
Thermally conductive materials are applied locally only in the regions where heat dissipation is critical, such as beneath and around the switching circuitry components. This localized approach provides effective thermal management where needed while avoiding the cost of applying thermal conductive materials across the entire circuit board, optimizing the balance between performance and manufacturing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances thermal management, prevents thermal damage, and allows for cost-effective, modular designs suitable for different applications, improving the operational reliability and flexibility of induction cooktops.
Implementation Method 1
the second board is constructed from thermally conductive materials to dissipate heat effectively
Implementation Method 2
an induction coil... Switching circuitry... is electrically interposing the power and control circuitry and the induction coil
Implementation Method 3
induction coil... configured to supply power to the induction coil
Data Source
AI summary
A circuit apparatus for an induction cooktop including at least one induction coil. At least one first circuit board extends along a first plane. At least one second circuit board extends along a second plane and is rigidly connected with the at least one first circuit board. Power circuitry is disposed on the at least one first circuit board and is configured to supply power to the at least one induction coil. Switching circuitry is disposed on the at least one second circuit board and is electrically interposing the power and control circuit and the at least one induction coil. The switching circuitry supplies a drive signal to the at least one induction coil. A control circuit is disposed on the at least one first circuit board and is configured to control the switching circuitry.