Liquid Jet Head Circuit Board Integration for Thin Profile
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Solution Overview
Problem
Conventional liquid jet heads have a bulky design due to protruding wiring boards and multiple circuit boards, which increase weight, complicate assembly, and limit the thinness of the region opposite to the liquid ejection side, making them inefficient for high-density recording and functional thin film formation.
Innovation Solution
A liquid jet head design featuring stacked head chips with integrated flexible printed circuit boards that overlap in a V- or Y-shape, reducing the thickness and number of parts, and using a single circuit board with driver ICs and thermally conductive materials to minimize weight and assembly complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple circuit boards and protruding wiring boards are used to supply drive signals, then the liquid jet head can achieve reliable electrical connection, but the weight increases and the region opposite to the liquid ejection side becomes bulky
Solution Approach 1:
The patent combines multiple circuit boards into a single integrated circuit board that houses multiple driver ICs. This merging approach maintains reliable electrical connections to multiple head chips while eliminating the weight and bulk associated with multiple separate circuit boards and wiring boards.
Solution Approach 2:
The single circuit board is designed to perform multiple functions by integrating multiple driver ICs that can independently control different head chips. This multi-functional design replaces the need for separate dedicated circuit boards for each head chip, reducing overall weight while maintaining connection reliability.
2Adaptability or versatility
If multiple circuit boards and wiring boards are used, then each head chip can be independently controlled, but the assembly process becomes complex and time-consuming
Solution Approach 1:
The patent merges multiple control functions into a single circuit board with multiple driver ICs, reducing the number of components that need to be assembled. This approach maintains the ability to independently control each head chip while significantly simplifying the assembly process by eliminating the need to assemble and align multiple separate circuit boards and wiring boards.
Solution Approach 2:
The circuit board is segmented into multiple regions, each housing a driver IC that independently controls a specific head chip. This segmentation allows for independent control of each head chip while maintaining a unified, simplified assembly structure.
3Reliability
If protruding wiring boards are used to supply drive signals, then electrical connection is achieved, but the region opposite to the liquid ejection side cannot be made thin
Solution Approach 1:
The patent merges all electrical connection functions into a single planar circuit board layout, eliminating the need for protruding wiring boards. This integration allows the region opposite to the liquid ejection side to be made thin while maintaining reliable electrical connections through the circuit board's trace routing.
Solution Approach 2:
The patent transitions from a three-dimensional arrangement with protruding wiring boards to a two-dimensional planar circuit board design. This dimensional change eliminates the protrusion issue and allows the head structure to be thinner while maintaining all necessary electrical connections through the circuit board's conductive traces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design thins the region opposite to the liquid ejection side, reduces weight, simplifies assembly, and lowers manufacturing costs by minimizing the number of parts and assembly steps, while maintaining efficient liquid ejection capabilities.
Implementation Method 1
The two walls formed of the piezoelectric body deform in accordance with the drive signal to change the capacity of the channel portion 115. This causes liquid filled in the channel portion 115 to be ejected from nozzles.
Data Source
AI summary
Provided is a liquid jet head in which a region of the liquid jet head on a side opposite to a liquid ejection side thereof is thinned to enhance efficiency of use of the region. A liquid jet head (1) includes an ejecting portion (3) for ejecting liquid in which first and second head chips (2a and 2b) are stacked, a circuit board (4) for supplying a drive signal for driving the ejecting portion (3), a first flexible printed circuit board (5a) for electrically connecting the first head chip (2a) and the circuit board (4) to each other, and a second flexible printed circuit board (5b) for electrically connecting the second head chip (2b) and the circuit board (4) to each other. The circuit board (4) and each of the first and second flexible printed circuit boards (5a and 5b) are electrically connected to each other on one surface (S) of the circuit board (4).