Electronic Device Peripheral Bonding for Thermal-Stress Stability
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Solution Overview
Problem
Existing electronic devices face challenges in durability due to the use of conductive tape requiring high precision in manufacturing, which hinders automation, and metal components bending under thermal stress, leading to device deterioration.
Innovation Solution
An electronic device design featuring a substrate with a first electrode layer, conductive and insulating glues, and a metal element fixed via these glues, where the insulating glue extends parallel to the substrate edge, ensuring the conductive glue and insulating glue lengths are less than the insulating glue, enhancing durability and automation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive tape is used to fix and electrically connect electronic components, then electrical connection is achieved, but manufacturing precision requirements increase and automation becomes difficult
Solution Approach 1:
The patent extracts the metal component from the traditional conductive tape structure and replaces it with a flexible printed circuit board (FPC) having a finger-shaped conductive pattern. This separation allows the conductive function to be integrated into a flexible substrate that can accommodate misalignment, thereby reducing manufacturing precision requirements while maintaining electrical connection reliability.
Solution Approach 2:
The patent changes the physical parameters of the conductive structure by using a flexible substrate with a specific finger-shaped conductive pattern design. The conductive pattern includes multiple fingers with increasing width from bottom to top, and the substrate's flexibility allows it to deform and adapt to misalignment between components, thus reducing the need for high precision manufacturing.
2Reliability
If metal components are used in electronic devices, then electrical connection is provided, but the metal components bend under hot and cold impact, causing device deterioration
Solution Approach 1:
The patent changes the material parameter from rigid metal to flexible polymer substrate with conductive traces. The flexible substrate can deform elastically under thermal stress without permanent deformation or bending, maintaining both electrical connection and structural stability through temperature variations.
Solution Approach 2:
The patent uses a composite structure combining flexible polymer substrate with conductive material (such as copper traces or conductive ink) to create a flexible printed circuit board. This composite material provides both the electrical conductivity needed for connection and the flexibility needed to resist thermal deformation, solving the contradiction between electrical function and thermal stability.
Data Source
AI summary
An electronic device including an active region and a peripheral region, and includes a substrate including a first edge; a first electrode layer disposed on the substrate; a first conductive glue disposed on the substrate and in the peripheral region; a second conductive glue disposed on the substrate and in the peripheral region; an insulating glue disposed in the peripheral region and overlapped with the first conductive glue and the second conductive glue; and a first metal element fixed on the first electrode layer through the first conductive glue and the insulating glue; wherein in a top view, the insulating glue extends along an extension direction parallel to the first edge, and along the extension direction, a sum of lengths of the first conductive glue and the second conductive glue is less than a length of the insulating glue.