Vertical Cold Plate With Waterfall Flow for GPU Heat Dissipation
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Solution Overview
Problem
Existing cooling systems for computer processors, particularly in vertical arrangements with multiple GPUs, face inefficiencies due to gravity and thermal capacity limitations of air cooling, necessitating improved liquid cooling solutions that maintain efficient heat removal.
Innovation Solution
A vertical cold plate design utilizing a waterfall effect with internal partitions to direct cooling fluid flow in alternating directions, promoting turbulent contact and efficient heat transfer through single-phase or two-phase liquids, enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air cooling is used for vertical GPU configurations, then the cooling system is simple, but the thermal capacity is insufficient and heat removal efficiency deteriorates
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by introducing a cold plate with liquid cooling channels. The liquid cooling system uses a pump to circulate coolant through the cold plate, providing superior thermal capacity and heat removal efficiency compared to air cooling, while maintaining manageable system complexity through integrated design
2Loss of energy
If conventional liquid cooling is used, then heat removal efficiency is improved, but gravity causes uneven fluid distribution and cooling performance deteriorates
Solution Approach 1:
The patent reorients the cooling system from horizontal to vertical configuration, changing the gravitational direction relative to the cooling channels. The cold plate is positioned with its cooling channels oriented vertically, allowing gravity to assist fluid distribution from top to bottom, ensuring uniform coolant flow and stable cooling performance throughout the GPU module
3Ease of operation
If cooling channels are positioned horizontally, then fluid flow is straightforward, but thermal contact with the processor deteriorates
Solution Approach 1:
The patent repositions the cooling channels from horizontal to vertical orientation within the cold plate. This vertical arrangement allows the cooling channels to extend directly beneath the processor in contact with the heat generation source, maximizing thermal contact and heat transfer efficiency while maintaining straightforward fluid flow through gravity-assisted circulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vertical cold plate design effectively manages heat dissipation in vertical GPU configurations by leveraging fluid dynamics to enhance thermal transfer and maintain optimal operating temperatures.
Implementation Method 1
at least one enclosure disposed on the at least one cold plate proximate the at least one processor... configured to direct a flow of a cooling fluid to cool the at least one processor
Implementation Method 2
direct a flow of a cooling fluid to cool the at least one processor
Implementation Method 3
vertical partition configured to allow the cooling fluid to enter on a first side of the vertical partition... direct the cooling fluid along the first side of the enclosure in a first direction, and direct the cooling fluid, after directing the cooling fluid along the first side of the enclosure in the first direction, along the second side of the enclosure in a second direction, and wherein the second direction is in a direction 180 degrees relative to the first direction
Data Source
AI summary
A system for processor cooling includes: at least one motherboard; at least one daughterboard disposed on the at least one motherboard; at least one cold plate disposed on the at least one daughterboard; at least one processor disposed on the at least one daughterboard; and at least one enclosure disposed on the at least one cold plate proximate the at least one processor on a side of the at least one processor opposite the at least one daughterboard, wherein the at least one enclosure is configured to direct a flow of a cooling fluid to cool the at least one processor.