Electronic Device Sealing Structure for Narrow-Bezel Bonding
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Solution Overview
Problem
As electronic devices become thinner, the bonding strength between the frame and other elements decreases, necessitating an increase in mechanical strength at the frame.
Innovation Solution
A sealing structure is designed with a recess structure in the sealant region, enhancing the contact area between the substrate and the sealing material, which includes filler particles, to increase bonding strength and mechanical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the frame thickness is decreased to make the device thinner, then the device can achieve a narrower bezel and more compact design, but the bonding strength between the frame and other elements decreases
Solution Approach 1:
The patent introduces a recess structure in the sealant region that extends in the vertical dimension (depth) to increase the contact area between the substrate and sealing material. This dimensional change allows the bonding interface to expand beyond the original planar contact, thereby compensating for the reduced frame thickness while maintaining adequate bonding strength.
Solution Approach 2:
The recess structure is specifically positioned in the sealant region where bonding strength is most critical. By creating a localized recess with specific depth and width dimensions, the patent concentrates the bonding enhancement where it is most needed, allowing the frame to remain thin overall while having increased contact area at the critical sealing interface.
2Strength
If the bonding area between the frame and substrate is increased to improve mechanical strength, then the bonding strength increases, but the device complexity increases
Solution Approach 1:
The sealing structure is segmented into distinct functional regions: the frame structure, the recess structure within the sealant region, and the bonding interface. This segmentation allows each component to be optimized independently - the frame for mechanical strength, the recess for bonding area, and the sealant material for adhesion - while maintaining overall structural integrity without excessive complexity.
Solution Approach 2:
The recess structure is formed as a preliminary feature in the sealant region before final assembly. This preliminary action creates the enhanced bonding interface in advance, ensuring that when the frame and substrate are assembled, the maximum bonding area is already in place, thereby simplifying the final assembly process while achieving high mechanical strength.
Data Source
AI summary
An electronic device is provided. The electronic device includes a substrate having an edge and a peripheral area adjacent to the edge, a first inorganic insulating layer disposed on the first substrate, an organic insulating layer disposed on the first inorganic insulating layer and including a recess in the peripheral area, and a second inorganic insulating layer disposed on the organic insulating layer and in the recess. In a top view, the recess extends in a first direction parallel to the edge of the substrate. In a cross-sectional view, the recess has a bottom portion adjacent to the substrate, and a width of the bottom portion of the recess is greater than a thickness of the organic insulating layer.