Conductive Heat Sink Positioning via Electrical Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing circuit arrangements with heat sinks for cooling electronic components face challenges in achieving an enhanced cooling effect while ensuring efficient and cost-effective manufacturing processes.
Innovation Solution
A circuit arrangement featuring a circuit carrier with contact pads and conductor tracks, where a heat sink made of electrically conductive material or with conductive strips is attached to provide an electrically conductive connection between electrical contacts, ensuring proper positioning and effective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat sink is made of electrically conductive material and used for cooling electronic components, then the cooling effect is improved, but the risk of electrical short circuits increases
Solution Approach 1:
The heat sink is divided into multiple electrically isolated segments or zones. Each segment can be electrically isolated from others through design features such as physical separation, non-conductive barriers, or electrical insulation layers between contact points, allowing the heat sink to maintain its cooling function while preventing electrical short circuits between different areas.
Solution Approach 2:
An electrically insulating intermediary layer or coating is introduced between the electrically conductive heat sink and the circuit carrier or electronic components. This intermediary maintains thermal contact for cooling purposes while providing electrical insulation to prevent short circuits, thus resolving the contradiction between electrical conductivity for cooling and electrical isolation for safety.
2Manufacturing precision
If the heat sink position is precisely measured using mechanical or optical measurement methods, then the positioning accuracy is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The heat sink's own electrical properties are utilized for position detection. By measuring electrical conductivity or resistance between the heat sink and reference points on the circuit carrier, the system automatically determines heat sink positioning without requiring external mechanical or optical measurement devices. This self-service approach simplifies the manufacturing process while maintaining positioning accuracy.
Solution Approach 2:
Mechanical or optical measurement systems are replaced with electrical measurement methods. Instead of using complex mechanical gauges or optical sensors to verify heat sink position, the patent uses simple electrical conductivity measurements through the heat sink material itself, substituting a complex mechanical/optical system with a simpler electrical detection system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the cooling effect of the heat sink by ensuring direct electrical contact and mechanical fixation, thereby preventing damage to electronic components and simplifying the manufacturing process through reduced complexity in measuring the heat sink's position.
Implementation Method 1
The heat sink shall receive heat or take heat from the circuit carrier and/or from the electronic components provided on it in known manner, for example for distributing the heat into the surrounding air or into a stream of cooling air from a fan or the like
Implementation Method 2
distributing the heat into the surrounding air or into a stream of cooling air from a fan or the like
Implementation Method 3
The electrically conductive material of the heat sink connects to both electrical contacts, either due to its own conductivity or due to the conductivity of the separate metal strips attached to it
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
A circuit arrangement comprises a circuit carrier with contact pads and conductor tracks thereon, electronic components on the circuit carrier generating heat in their operation. A heat sink is provided for receiving heat from the circuit carrier and from the components, wherein the heat sink is made of aluminum and is fastened to the circuit carrier and bears directly against the circuit carrier. At least two electrical contacts, which are separate from one another and against which the heat sink rests in an electrically conductive manner, are arranged on the upper side of the circuit carrier against which the heat sink rests. The two electrical contacts are electrically connected to conductor tracks and to a control in order to measure electrical through-contacting by the heat sink by means of the two electrical contacts.