Conductive Metal Ink for Roll Printing Stability
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Solution Overview
Problem
Current conductive ink compositions for roll printing lack sufficient conductivity and attachment ability to substrates, leading to instability and peeling issues during the PECVD process in flat panel display manufacturing.
Innovation Solution
A conductive metal ink composition comprising a first metal powder with high conductivity, a non-aqueous solvent system with varying vapor pressures, an attachment improving agent such as nickel or bismuth, and a polymer coating property improving agent, which enhances attachment to substrates and maintains pattern stability during roll printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional conductive ink composition is used for roll printing, then the printing process can be simplified, but the conductivity and attachment ability of the formed pattern are insufficient
Solution Approach 1:
The patent uses a composite ink composition containing silver powder (conductive metal) combined with nickel powder (attachment improving agent) in specific weight ratios (silver: 90-99 wt%, nickel: 1-10 wt%). This composite formulation allows the ink to simultaneously achieve high conductivity from silver and strong attachment ability from nickel, resolving the contradiction between process simplicity and pattern reliability in roll printing applications
Solution Approach 2:
The patent optimizes specific parameters including the weight ratio of conductive metal powder to attachment improving agent (90:10 to 99:1), particle size distribution of metal powders (0.1-10 μm), and solvent composition (mixing volatile and non-volatile solvents in specific ratios). These parameter adjustments enable the ink to maintain appropriate viscosity for roll printing while ensuring high conductivity and attachment ability of the fired pattern
2Reliability
If conductive metal powder is used in the ink composition, then conductivity is improved, but attachment ability to the substrate deteriorates and agglomeration occurs during firing
Solution Approach 1:
The patent introduces nickel powder as an intermediary material that mediates between the conductive silver powder and the glass substrate. The nickel particles form intermediate bonds with both the silver conductive network and the substrate surface, preventing silver particle agglomeration during firing while enhancing attachment ability. This intermediary approach allows high conductivity from silver to be maintained without sacrificing substrate attachment
Solution Approach 2:
The patent creates a composite metal powder system where silver particles (providing conductivity) are combined with nickel particles (providing attachment) in optimized ratios and size distributions. The composite structure prevents agglomeration during the firing process while ensuring both high conductivity and strong substrate attachment of the final pattern
3Ease of operation
If the ink has low viscosity for good coating, then coating performance is improved, but pattern transfer precision and fine pattern formation deteriorate
Solution Approach 1:
The patent creates a dynamic viscosity system by combining volatile solvents (high vapor pressure) and non-volatile solvents (low vapor pressure) in specific ratios. During the coating process, the volatile solvent evaporates first, causing the ink viscosity to increase dynamically on the roller surface. This dynamic viscosity change allows the ink to be easily applied initially (low viscosity) and then maintain sharp pattern edges during transfer (high viscosity), resolving the contradiction between coating ease and pattern precision
4Manufacturing precision
If photolithography process is used to form conductive patterns, then pattern precision is improved, but process complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts and eliminates the complex photolithography steps (coating, exposing, developing, etching) from the manufacturing process by using a specialized conductive ink formulation that can be directly printed and fired. The ink contains all necessary components (conductive metal, attachment improving agent, viscosity controllers) to achieve precise pattern formation through simple screen or roll printing followed by firing, thereby maintaining pattern precision while dramatically reducing process complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved conductivity and stable attachment of conductive patterns to substrates, preventing peeling and ensuring reliable performance under severe PECVD conditions.
Implementation Method 1
a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or less at 25° C. and a second non-aqueous solvent having a vapor pressure of more than 3 torr at 25° C.
Data Source
AI summary
The present invention relates to a conductive metal ink composition, comprising: a first metal powder having conductivity; a non-aqueous solvent; an attachment improving agent; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition, and the conductive metal ink composition can be appropriately applied to a roll printing process and a conductive pattern exhibiting more improved conductivity and excellent attachment ability with respect to a board can be formed.