Conductive Layer Formation on Resin Base Materials via Dry Blasting
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Solution Overview
Problem
Conventional methods for forming a conductive layer on an insulating resin base material face challenges in achieving both improved adhesion strength and process efficiency, often requiring multiple steps to remove detached or detachable filler and facing issues with brittle resin portions.
Innovation Solution
A method involving a roughening step, blasting step, modification step, and conductive layer formation steps, including dry blasting and wet film formation, to enhance adhesion and streamline the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If three steps (first alkali treatment, ultrasonic cleaning treatment, and second alkali treatment) are performed to remove filler likely to detach, then adhesion strength between insulating resin layer and conductive layer is improved, but process time and complexity are extended
Solution Approach 1:
The conventional three-step process (first alkali treatment, ultrasonic cleaning, second alkali treatment) is segmented and reorganized into a more efficient sequence: roughening treatment followed by a single blasting treatment. This segmentation allows the removal of filler and brittle resin portions to be achieved in fewer distinct stages while maintaining adhesion improvement benefits.
Solution Approach 2:
The roughening treatment is performed as a preliminary action before the blasting treatment. This preliminary roughening of the insulating resin layer surface creates optimal conditions for the subsequent blasting treatment to effectively remove filler and brittle portions, thereby achieving good adhesion strength with fewer overall process steps.
2Strength
If conventional three-step process is used to remove detached filler, then adhesion strength is improved, but process complexity increases
Solution Approach 1:
The functions of multiple conventional treatments (alkali treatment and ultrasonic cleaning) are merged into a single blasting treatment step. This merging eliminates the need for separate treatment stages while achieving the same or better effect of removing detached filler and brittle resin portions, thereby reducing process complexity.
Solution Approach 2:
The blasting treatment is designed to perform multiple functions simultaneously: it removes detached filler, eliminates brittle resin portions, and prepares the surface for conductive layer formation. This multi-functionality replaces the need for multiple specialized treatment steps, simplifying the overall process while maintaining adhesion strength improvement.
3Strength
If multiple treatment steps are performed to remove brittle resin portions, then adhesion strength is improved, but manufacturing efficiency is reduced
Solution Approach 1:
The blasting treatment selectively extracts and removes only the problematic portions (detached filler and brittle resin portions) from the insulating resin layer surface. This targeted extraction approach achieves adhesion improvement without requiring multiple treatment steps, thereby maintaining high manufacturing efficiency.
Solution Approach 2:
The process skips intermediate treatment steps by transitioning directly from roughening treatment to blasting treatment. This rushing through of the essential treatment stages eliminates unnecessary process delays while still achieving effective removal of brittle portions and improving adhesion strength, thus enhancing manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves adhesion strength between the insulating resin base material and the conductive layer while significantly reducing the number of processing steps, enhancing the stability and efficiency of the conductive layer attachment process.
Implementation Method 1
a blasting step of performing blast treatment on the surface of the insulating resin base material on which the roughening treatment has been performed, by dry blasting
Implementation Method 2
a roughening step of performing roughening treatment on a surface of an insulating resin base material
Implementation Method 3
a modification step of performing surface modification on the surface of the insulating resin base material on which the blast treatment has been performed
Data Source
AI summary
A method for forming a conductive layer-attached resin base material includes a roughening step, a blasting step, a modification step, a first conductive layer formation step, and a second conductive layer formation step. The roughening step performs roughening treatment on a surface of an insulating resin base material. The blasting step performs blast treatment on the surface of the insulating resin base material on which the roughening treatment has been performed, by dry blasting. The modification step performs surface modification on the surface of the insulating resin base material on which the blast treatment has been performed. The first conductive layer formation step forms a first conductive layer on the insulating resin base material on which the surface modification has been performed. The second conductive layer formation step forms a second conductive layer on the first conductive layer by a wet film formation process.