Conductive Layer Thermal Dissipation and EMI Shielding in Semiconductor Packages
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Solution Overview
Problem
Semiconductor packages face challenges with thermal dissipation and electromagnetic interference (EMI) as operation speed increases and device size decreases, leading to inefficient heat management and potential damage to electronic components.
Innovation Solution
A semiconductor package design featuring a substrate with a grounding element, a semiconductor chip, and a conductive connecting element that extends beyond the chip's lateral edge, encapsulated in a package body with a recess exposing the chip's upper surface, and covered by a conductive layer for both thermal dissipation and EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If device size decreases and operation speed increases, then productivity and device integration are improved, but thermal dissipation becomes more difficult and EMI increases
Solution Approach 1:
The conductive layer extends beyond the lateral edges of the semiconductor chip into the surrounding space, utilizing three-dimensional space for thermal management. This dimensional extension allows heat dissipation pathways to radiate outward in multiple directions rather than being confined to the chip plane, effectively increasing the thermal dissipation surface area without increasing the device footprint.
Solution Approach 2:
The conductive layer serves multiple functions simultaneously: it acts as a thermal dissipation pathway to conduct heat away from the chip, provides EMI shielding to protect against electromagnetic interference, and extends the grounding element to enhance electrical stability. This multi-functionality addresses multiple problems (thermal, electromagnetic, and electrical) with a single structural element.
2Productivity
If device size decreases and operation speed increases, then productivity and device integration are improved, but electromagnetic interference (EMI) among semiconductor elements worsens
Solution Approach 1:
The conductive layer serves multiple functions simultaneously: it acts as a thermal dissipation pathway to conduct heat away from the chip, provides EMI shielding to protect against electromagnetic interference, and extends the grounding element to enhance electrical stability. This multi-functionality addresses multiple problems (thermal, electromagnetic, and electrical) with a single structural element.
Solution Approach 2:
The conductive layer acts as an intermediary shielding structure between the semiconductor chip and the external electromagnetic environment. By positioning the conductive layer to extend beyond the chip edges and contact the grounding element, it creates a protective barrier that intercepts and redirects electromagnetic emissions, preventing them from affecting adjacent semiconductor elements.
3Productivity
If high-density distribution of semiconductor elements is implemented, then productivity is improved, but thermal dissipation and EMI shielding become more difficult
Solution Approach 1:
The conductive layer extends beyond the lateral edges of the semiconductor chip into the surrounding space, utilizing three-dimensional space for thermal management. This dimensional extension allows heat dissipation pathways to radiate outward in multiple directions rather than being confined to the chip plane, effectively increasing the thermal dissipation surface area without increasing the device footprint.
4Productivity
If high-density distribution of semiconductor elements is implemented, then productivity is improved, but EMI shielding effectiveness worsens
Solution Approach 1:
The conductive layer serves multiple functions simultaneously: it acts as a thermal dissipation pathway to conduct heat away from the chip, provides EMI shielding to protect against electromagnetic interference, and extends the grounding element to enhance electrical stability. This multi-functionality addresses multiple problems (thermal, electromagnetic, and electrical) with a single structural element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively enhances thermal dissipation and EMI shielding without compromising device reliability, safety, or cost, by using a conductive layer that directly contacts the grounding element and chip, improving heat transfer and shielding effectiveness across a wide frequency range.
Implementation Method 1
A combination of the conductive element and the conductive layer provides thermal dissipation and electromagnetic interference (EMI) shielding for the semiconductor package
Implementation Method 2
A combination of the conductive element and the conductive layer provides thermal dissipation and electromagnetic interference (EMI) shielding for the semiconductor package
Data Source
AI summary
Semiconductor packages and related methods. The semiconductor package includes a substrate, a semiconductor chip, a package body, a recess and a conductive layer. The substrate includes a grounding element. The semiconductor chip is disposed on the substrate and has a lateral surface and an upper surface. The package body encapsulates the lateral surface of the semiconductor chip. The recess is formed in the package body and exposes the upper surface of the semiconductor chip. The conductive layer covers an outer surface of the package body, the grounding element and the upper surface of the semiconductor chip exposed by the recess to provide both thermal dissipation and EMI shielding for the semiconductor chip.