Conductive Leads for High Current Circuit Packaging
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Solution Overview
Problem
Conventional bond wires are not suitable for high current applications as they do not support high current throughput and lack adequate heat sink capabilities, leading to potential failure in high current applications.
Innovation Solution
The development of an electronic circuit package with electrically and thermally conductive leads that can handle high current and heat, featuring a semiconductor device with a planar surface and conductive elements, where the leads provide low impedance connectivity between circuit nodes and a substrate, allowing for safe conduction of high currents and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bond wires are used to provide connectivity between semiconductor device and circuit board, then the device structure is simple and manufacturing cost is low, but the current carrying capability is insufficient and thermal management is inadequate for high current applications
Solution Approach 1:
The package structure is segmented into distinct functional regions: a cavity formed by leads for housing the semiconductor device, separate lead portions for electrical connection, and specific configurations for thermal management. This segmentation allows each component to be optimized independently for high current applications while maintaining overall structural integrity.
Solution Approach 2:
The semiconductor device is nested within the cavity formed by the leads, creating a compact integrated structure. The leads themselves are nested configurations that form the cavity walls while providing external connection points, maximizing space utilization and thermal contact area for high current dissipation.
2Temperature
If conventional bond wire technology is used, then manufacturing is simple and cost-effective, but thermal heat sinking capability is insufficient for high current applications
Solution Approach 1:
The leads serve multiple functions simultaneously: they provide electrical connection, form the structural cavity housing, and act as thermal pathways for heat dissipation. This merging of functions into a single integrated component simplifies manufacturing while effectively addressing thermal management requirements for high current applications.
Solution Approach 2:
The lead structure is designed as a multi-functional component that performs electrical conduction, mechanical support, thermal management, and structural definition all in one element. This universal design reduces the number of separate components needed and simplifies the manufacturing process while meeting high current application requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the safe conduction of high currents and effective heat sinking, making it suitable for applications such as switching power supplies and voltage regulators, enhancing reliability and performance in high current applications.
Implementation Method 1
The multiple leads provide low impedance connectivity between circuit nodes on the electronic circuitry and pads disposed on a planar surface of the electronic circuit package. Each of the multiple leads can support high current.
Implementation Method 2
devices using bond wires to provide conductive paths are prone to failure in high current applications... effective heat sinking... The multiple leads provide low impedance connectivity between circuit nodes on the electronic circuitry and pads disposed on a planar surface of the electronic circuit package
Data Source
AI summary
A circuit package includes: electronic circuitry, electrically conductive material forming multiple leads, and multiple connections between the electronic circuitry and the multiple leads. A portion of the electrically conductive material associated with the multiple leads (e.g., low impedance leads supporting high current throughput) is removed to accommodate placement of the electronic circuitry. Each of the multiple leads can support high current. The multiple connections between the, the multiple leads provide connectivity between circuit nodes on the electronic circuitry and pads disposed on a planar surface of the electronic circuit package.