Conductive Micro Traces Fabrication via Deform and Selective Removal
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Solution Overview
Problem
Existing methods for forming conductive micro traces on substrates face challenges in achieving narrow width dimensions while maintaining optical properties, particularly in applications like plasma display panels and vehicle windows, and are often costly.
Innovation Solution
A method involving stamping techniques with pressure and thermal processing to form conductive micro traces on flexible substrates, using techniques like vacuum deposition, electroplating, and mechanical removal to achieve desired dimensions and properties, with the option of using thermoplastic materials for differential adhesion and release layers for efficient material removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to form conductive micro traces, then the traces can be formed on the substrate, but the width dimension cannot be reduced below 25 microns
Solution Approach 1:
The patent segments the trace formation process into distinct stages: applying conductive material to the entire substrate, forming a deformable layer over it, selectively deforming the deformable layer in desired trace patterns, and then selectively removing the conductive material where the deformable layer is deformed. This segmentation enables precise control of trace width while simplifying each individual step.
Solution Approach 2:
The patent applies preliminary action by first depositing the conductive material across the entire substrate before any patterning occurs. The deformable layer is then applied over the conductive material in advance, preparing the structure for selective deformation and subsequent material removal. This preliminary preparation enables precise trace formation with widths below 25 microns.
2Reliability
If conductive micro traces are formed on optical filters, then electrical conductivity is achieved, but optical properties are adversely affected
Solution Approach 1:
The patent applies local quality by confining the conductive material exclusively to the micro trace regions where electrical conductivity is needed, while leaving the surrounding optical filter areas free of conductive material. The selective deformation and removal process ensures that optical properties are preserved in non-trace areas while achieving reliable electrical conductivity in the trace patterns.
3Manufacturing precision
If precise narrow trace widths are achieved, then manufacturing precision is improved, but production cost increases
Solution Approach 1:
The patent employs self-service by using the deformable layer to automatically define the trace patterns through selective deformation. The deformable layer's mechanical response to applied stress naturally confines the conductive material to the desired trace regions, eliminating the need for expensive precision alignment systems or complex lithography equipment, thereby achieving narrow trace widths at lower production costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the cost-effective formation of conductive micro traces with widths less than 25 microns, maintaining optical properties and achieving desired electrical conductivity, suitable for various applications including plasma display panels and vehicle windows.
Implementation Method 1
In the pressure-application step, the pressure or a combination of pressure and temperature is sufficient to at least weaken the integrity of the bulk conductive material along the area of contact
Implementation Method 2
a thermal stamping approach may be utilized
Implementation Method 3
there are advantages to using a raw substrate formed of a thermoplastic material
Implementation Method 4
direct vacuum deposition
Implementation Method 5
a vacuum deposition followed by a buildup (e.g., plating) of additional material
Data Source
AI summary
In a method of forming micro traces, stamping techniques are employed to define a target pattern of the micro traces. The stamping is applied to electrically conductive material and may be limited to pressure, but a thermal stamping approach may be utilized. Following the stamping, a portion of the conductive material is removed, leaving the target pattern of conductive micro traces. In the pressure-application step, the pressure or the combination of pressure and temperature is sufficient to at least weaken the integrity of the bulk conductive material along the area of contact. Typically, this step causes shearing of the conductive material. Following the pressure-application step, excess conductive material is removed. In some embodiments of the invention, the thickness of the micro traces is not determined in a single step. The original thickness may be formed using a “seed” material. The subsequent material buildup may occur after the target pattern is established.