Transfer Patterning TRIZ Cases
- Laser Lift Printing of Metal Traces for Ohmic Silicon Contacts
Ultrashort laser pulses eject thin-film metal droplets onto silicon to form low-resistance ohmic traces without annealing or screen-print shadowing.
- Circuit Interconnection on Flexible Substrates Using LIFT Printing
Laser-induced forward transfer prints conductive traces over fixed die contacts on flexible, porous substrates to form precise ohmic connections.
- Laser-Driven Explosive Bonding for Dense Refractory Metal Coatings
A laser-driven foil impact process bonds dissimilar and refractory metals into dense, porosity-free coatings with strong adhesion.
- Core Substrate Trench Vias for Fine-Pitch Thick Package Cores
Laser-assisted etching forms crack-free fine-pitch vias in thick package cores, boosting via density while reducing parasitics and impedance issues.
- Laser-Melted Conductive Tracks on Ceramic Insulating Coatings
Laser additive manufacturing forms conductive tracks directly on ceramic insulating coatings, cutting masking, post-processing, and material waste.
- Viscous Material Transfer With Addressable Resistive Heating
Individually addressable resistive heaters generate interfacial gas for uniform viscous-material transfer across complex substrate topographies.
- Stretchable Donor Plate for Precise Uneven-Surface Deposition
A pressurized stretchable layer conforms to uneven targets, while photon radiation transfers donor material from recessed areas.
- Pick-and-Place Tool With In-Situ Die Position Detection
A pick-and-place tool mounting head detects actual die positions using a dedicated unit to enable real-time pattern adjustments.
- Laser-Assisted Deposition for Thick Metal Patterns
A laser beam deposits patterning material from a solid layer onto a transparent substrate to form thicker metal traces.
- Thermal Printing Head for Printed Circuit Board Conductor Tracks
Selective heating of conductive printing medium transfers material onto substrates, eliminating slow chemical etching processes.
- Conductive Micro Traces Fabrication via Deform and Selective Removal
Pressure-based stamping creates sub-25 micron conductive traces while preserving optical transmission in display panels.
- Conductive Trace Deposition via Segmented Thermoplastic Film
Segmented thermoplastic films deposit conductive traces via selective adhesion, resolving the trade-off between foil bonding strength and trace fineness.
- Adhesive Layer Transfer for Poor Adherence Materials
A sticky polymer intermediary bridges material and substrate to resolve adhesion reliability issues while preserving original material composition.