Laser-Melted Conductive Tracks on Ceramic Insulating Coatings
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Solution Overview
Problem
Existing methods for forming electric circuits on insulating surfaces, such as thermal spray, PVD, and ink jet printing, require additional processing steps, special toolings, high material and energy consumption, and are limited by low deposition rates or complex masking processes, making them inefficient and costly.
Innovation Solution
Laser additive layer manufacturing (LALM) processes, such as selective laser melting (SLM) or laser beam-powder bed fusion (LB-PBF), deposit electrically conductive tracks directly onto insulating surfaces without masking or post-processing, using Ni-, Fe-, Al-, or Cu-based alloys, achieving high productivity and material efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If thermal spray technology is used to deposit conductive material, then high application rate and low material cost are achieved, but masking and post-processing are required which increase complexity and cost
Solution Approach 1:
The patent extracts and removes the masking step entirely from the thermal spray process by using a floating mask that is applied directly to the substrate and removed after deposition, eliminating the need for complex masking setups and post-processing laser ablation
Solution Approach 2:
The patent introduces a floating mask as an intermediary element that enables selective deposition without requiring complex masking infrastructure. The floating mask serves as a temporary mediator that is easily applied and removed, simplifying the overall process
2Ease of manufacture
If PVD is used to deposit conductive material, then floating masks can be easily applied and reused, but deposition rate is very low requiring vacuum conditions and long processing times
Solution Approach 1:
The patent replaces the vacuum-based PVD mechanical system with atmospheric plasma spray technology, eliminating the need for vacuum conditions while maintaining the ability to use floating masks. This substitution dramatically increases deposition rate from hours to minutes per square meter
3Device complexity
If ink jet printing is used to apply conductive material, then masking is avoided, but processing speed is low and post-treatment drying and sintering are required which consume time and energy
Solution Approach 1:
The patent changes the physical state and deposition parameters by using atmospheric plasma spray instead of ink jet printing. The conductive material is deposited as a powder or aerosol that is immediately sintered by the plasma energy, eliminating the need for separate drying and sintering steps and dramatically increasing processing speed
4Quantity of substance
If thermal spray is used to deposit thick conductive layers, then sufficient thickness is achieved for heater formation, but material consumption and energy use increase
Solution Approach 1:
The patent utilizes phase transitions of the conductive material through atmospheric plasma spray, where the material is heated to molten or vaporized state and then rapidly cooled upon deposition. This controlled phase transition enables efficient material utilization and reduced consumption while achieving required thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
LALM processes significantly reduce material and energy consumption, enhance production efficiency, and produce homogeneous conductive tracks with lower electrical resistivity, eliminating the need for masking and post-processing, and enabling faster production times compared to traditional methods.
Implementation Method 1
directing a laser beam onto the conductive material on the ceramic surface and moving the laser beam relative to the ceramic surface along a predetermined pattern for the electric circuit, whereby the conductive material is melted onto the ceramic surface
Data Source
AI summary
A process of forming an electric circuit on an insulating ceramic substrate or on an insulating ceramic layer of a substrate that includes depositing a conductive material over a surface of the ceramic substrate or layer; and directing a laser beam onto the conductive material over the ceramic substrate or layer and moving the laser beam relative to the ceramic substrate or layer along a predetermined pattern for the electric circuit, whereby the conductive material is melted over the ceramic substrate or layer to form a conductive track.


