Pick-and-Place Tool With In-Situ Die Position Detection
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Solution Overview
Problem
Conventional pick-and-place machines in the packaging and assembly industry face challenges in accurately aligning stacked structures, as they often sacrifice throughput for precision, leading to inefficiencies in processes like die stacking and pattern alignment on workpieces.
Innovation Solution
A mounting head for pick-and-place tools equipped with a die position determining unit, which measures and detects the actual position of dies relative to measurement marks on the workpiece, allowing for real-time adjustment of pattern data for subsequent layers, enabling accurate alignment without the need for separate metrology tools.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional pick-and-place machines use slow placement speed to achieve necessary alignment accuracy, then manufacturing precision is improved, but productivity deteriorates
Solution Approach 1:
The system performs preliminary measurement of die positions using alignment marks before final placement. By pre-determining the actual positions of dies relative to measurement marks, the system can compensate for positioning errors in advance, allowing faster placement speeds while maintaining alignment accuracy through subsequent pattern data adjustments.
Solution Approach 2:
The system implements a feedback mechanism where the actual positions of dies are measured and detected, then this information is used to adjust the pattern data for subsequent layers. The die position determining unit provides real-time feedback on placement accuracy, enabling dynamic compensation and maintaining precision without requiring slow placement speeds.
2Measurement precision
If external metrology tools are used to measure die positions, then measurement precision is improved, but device complexity deteriorates
Solution Approach 1:
The pick-and-place machine's mounting head is equipped with a die position determining unit that performs both placement and measurement functions. This multi-functional approach eliminates the need for separate external metrology tools, reducing system complexity while maintaining measurement precision through integrated alignment mark detection.
Solution Approach 2:
The system uses its own mounting head to perform measurements of die positions rather than relying on external equipment. The mounting head determines the actual positions of dies relative to measurement marks on the workpiece, enabling the system to self-diagnose and compensate for positioning errors without additional external tools.
Data Source
AI summary
A pick-and-place tool configured to pick and place at least one die on a workpiece includes a mounting head. The mounting head includes a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.