Conductive Pattern Formation on Porous Substrates
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Solution Overview
Problem
Existing methods for forming conductive patterns face challenges with insufficient adhesion to substrates, particularly when using non-porous substrates, and lack guidance on suitable porousness for improved adhesion.
Innovation Solution
A method involving the ejection of a liquid-state material with conductive fine particles onto a porous base material, where the base material has cavities and communication holes that are in communication, ensuring the conductive particles remain on the surface and anchor effectively after sintering, enhancing adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a non-porous substrate is used for forming conductive patterns, then the substrate structure is simple, but the adhesion of the conductive pattern is insufficient
Solution Approach 1:
The patent applies porous materials by using a porous base material with controlled pore sizes (average diameter ≤ 200 nm) to form conductive patterns. The porous structure provides anchoring sites for conductive fine particles, significantly improving adhesion compared to non-porous substrates while maintaining structural integrity.
Solution Approach 2:
The patent applies local quality by creating localized porous regions with specific pore size distributions on the base material. The porous structure is optimized locally to match the size of conductive fine particles (1-200 nm), providing enhanced adhesion at the particle-substrate interface while keeping other areas of the substrate simple.
2Strength
If the pore size of the base material is increased to improve particle anchoring, then adhesion improves, but particles may pass through the pores and adhesion deteriorates
Solution Approach 1:
The patent applies parameter changes by precisely controlling the pore size parameter of the base material to be less than or equal to 200 nm, matching the size range of conductive fine particles. This parameter optimization ensures particles are retained in the porous structure for anchoring without passing through, achieving both adhesion improvement and particle retention reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in conductive patterns with improved adhesion and desired two-dimensional shapes, maintaining mechanical and electrical reliability even on flexible substrates, and is applicable in various electronic devices.
Implementation Method 1
a porous base material is used, wherein conductive fine particles having an average particle size of from 1 nm to 200 nm are contained; the porous base material includes a plurality of cavities formed therein and communication holes through which the plurality of cavities are in communication with each other, an average diameter of the communication holes being less than or equal to the average particle size of the conductive fine particles
Implementation Method 2
forming a conductive pattern by ejecting a liquid-state material containing conductive fine particles onto a porous base material
Data Source
AI summary
A method of forming a conductive pattern includes forming a conductive pattern by ejecting a liquid-state material containing conductive fine particles onto a porous base material, wherein the conductive fine particles have an average particle size of from 1 nm to 200 nm, and the porous base material is formed with a plurality of cavities and includes communication holes through which the plurality of cavities are in communication, an average diameter of the communication holes being less than or equal to the average particle size of the conductive fine particles.