Conductive Pattern Recess Bonding for Reliable Electronic Packaging
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Solution Overview
Problem
Conventional electronic devices suffer from low yield rates and reliability due to the small contact area between the circuit structure and bonding components, leading to potential damage and fractures.
Innovation Solution
The electronic device design includes a conductive pattern with a recess in which the bonding component is disposed, enhancing the contact area and bonding effect by overlapping the bonding component with a third portion of the conductive pattern, and a manufacturing method involving a carrier substrate, barrier layer, and recess formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a planar circuit structure is used, then the manufacturing process is simple, but the contact area between the circuit structure and bonding component is small, leading to low reliability
Solution Approach 1:
The conductive pattern transitions from a conventional planar (2D) structure to a three-dimensional structure with a recess. This dimensional change allows the bonding component to be embedded within the recess, significantly increasing the contact area between the bonding component and the conductive pattern, thereby improving bonding reliability without substantially complicating the manufacturing process.
2Strength
If a planar circuit structure is used, then the device structure is simple, but the contact area is small, leading to potential damage and fractures
Solution Approach 1:
By introducing a recess into the conductive pattern, the bonding structure moves from a surface-level connection to an embedded connection. This three-dimensional configuration increases the bonding interface area and provides mechanical interlocking, thereby enhancing bonding strength and reducing the risk of damage or fractures under stress.
Solution Approach 2:
The bonding component is nested within the recess of the conductive pattern, creating a nested structure where one component is partially housed within another. This nesting arrangement maximizes the contact area and provides structural support, thereby improving bonding strength without requiring additional external reinforcement structures.
3Productivity
If the contact area is increased by design, then the yield rate improves, but the manufacturing process becomes more complex
Solution Approach 1:
The recess structure is formed using standard semiconductor fabrication techniques such as photolithography and etching, which are already widely adopted in the industry. By integrating the recess formation into the existing manufacturing flow, the contact area is increased to improve yield rate without requiring fundamentally new manufacturing processes or equipment.
Data Source
AI summary
An electronic device includes an electronic component, a packaging layer, a circuit structure and a bonding component. The packaging layer surrounds the electronic component. The circuit structure is electrically connected to the electronic component, wherein the circuit structure includes a conductive pattern. The bonding component is disposed in a recess of the conductive pattern and overlaps the conductive pattern. The conductive pattern includes a first portion, a second portion and a third portion, the third portion is connected to the first portion and the second portion, the bonding component overlaps the third portion, and a width of the first portion is different from a width of the second portion.