Conductive Post Formation via Segmented Droplet Discharge
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Solution Overview
Problem
The existing methods for forming wiring patterns, such as lithography, are costly and inefficient, and the droplet discharge system struggles to create conductive posts of appropriate height without causing short circuits due to excessive diameter, limiting the refinement and multilayering of electronic apparatuses.
Innovation Solution
A method involving a droplet discharge system where the discharge head with multiple nozzles moves relative to the substrate, discharging droplets to form conductive posts with specific interval relationships, allowing for efficient formation of posts with integral multiples of nozzle intervals, and repeating the process to achieve the desired height while preventing interface cracks through simultaneous baking of liquid lines and posts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a droplet discharge system discharges plenty of droplets at a time to form a conductive post with appropriate height, then the post height requirement is met, but the post diameter becomes too large causing short circuits between adjacent electrical wirings or conductive posts
Solution Approach 1:
The conductive post formation process is segmented into multiple sequential droplet discharge steps. Instead of discharging all droplets at once, the system discharges droplets in multiple passes, allowing each droplet to be precisely positioned and preventing excessive lateral spreading that would increase post diameter and cause short circuits.
Solution Approach 2:
The method employs preliminary positioning of droplets at specific intervals before final post formation. By first establishing precise droplet positions according to the interval relationship b=m×a, and then building up the post height through controlled subsequent discharges, the system ensures both appropriate height and diameter control.
2Manufacturing precision
If lithography is used to form wiring patterns, then the wiring pattern can be formed, but huge facilities and complicated processes are required with high manufacturing cost
Solution Approach 1:
The patent replaces the complex mechanical lithography system with a droplet discharge system. Instead of using huge lithography facilities with vacuum systems and complex optical-mechanical processes, the invention uses a relatively simple droplet discharge head that can be moved relative to the substrate to deposit conductive material directly, forming wiring patterns and conductive posts through controlled droplet placement.
3Manufacturing precision
If the interval among conductive posts is not equal to integral multiples of the interval among nozzles, then flexible positioning is achieved, but the droplet discharge process becomes complex with wasted movement
Solution Approach 1:
The invention establishes a specific parameter relationship where the interval b among conductive posts is set to an integral multiple m of the interval a among nozzles (b=m×a). This parameter change optimizes the droplet discharge process by ensuring that during relative movement between the discharge head and substrate, droplets are placed efficiently without wasted movement, while still achieving the required positioning precision through the controlled interval relationship.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the droplet discharge process, reduces manufacturing costs, and ensures a reliable electrical connection by forming conductive posts with precise height and preventing short circuits, enabling the creation of refined and multilayered wiring patterns for downsized electronic devices.
Implementation Method 1
a droplet in which conductive microparticles are dispersed is discharged onto a substrate from a droplet discharge head to form a liquid line
Implementation Method 2
the liquid line is baked with heat treatment or laser irradiation or the like to form a wiring pattern
Implementation Method 3
the liquid line is baked with heat treatment or laser irradiation or the like to form a wiring pattern
Implementation Method 4
relatively moving a discharge head having a plurality of nozzles and the substrate in a predetermined direction while discharging droplets from predetermined nozzles among the plural nozzles to form the plural conductive posts
Implementation Method 5
simultaneous baking of liquid lines and posts
Data Source
AI summary
A method for forming a wiring pattern in which a plurality of electrical wirings deposited onto a substrate is conductively connected with each other through a plurality of conductive posts, the method including relatively moving a discharge head having a plurality of nozzles and a substrate in a predetermined direction while discharging droplets from predetermined nozzles among the plural nozzles to form the plural conductive posts, wherein, in the orthogonal direction of the above-referenced predetermined direction, the interval among the plural nozzles “a” and the interval among the plural conductive posts “b” satisfy an equation “b=m×a” (“m” may be any positive integer).