Liquid/Solution Decomposition Chemical Coating TRIZ Cases
- Floating Potential Electroless Plating for Copper Interconnects
Applying a floating potential to the plating bath deposits a smooth diffusion layer on copper interconnects.
- Sulphur Monitoring in Metal Plating Baths via Amperometry
Amperometric method measures sulphur compounds in plating baths using formaldehyde oxidation currents.
- Metal-Containing Film Formation Using Oxymethylene Reducing Agent
A metal compound composition uses an oxymethylene structure to generate aldehydes that reduce metal atoms during film formation.