Metal-Ceramic Substrate Silver Contact Area Formation

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Solution Overview

Problem

Existing methods for producing metal ceramic substrates with silver contact areas often result in surface damage, reduced adhesive strength, and the need for complex masking processes, which can lead to unreliable connections between the metal layer and the ceramic body.

Innovation Solution

A procedure for producing a metal ceramic substrate that involves applying a silver ink containing a silver carboxylate and a terpene, which is then decomposed to form a silver contact area without damaging the metal layer or requiring a silver-free masking process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If electrochemical deposition is used to create silver contact areas, then silver deposition is achieved, but surface damage occurs and adhesive strength is reduced

Engineering Contradiction:

Improvesilver depositionVSAvoidadhesive strength

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The patent replaces the electrochemical deposition process with a printing process that applies silver-containing paste or ink directly to the metal layer. This substitution eliminates the harmful electrochemical reactions that cause surface damage and adhesive strength reduction, while still achieving the desired silver contact areas for component bonding.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the deposition method from electrochemical to printing-based, altering the fundamental parameters of the silver application process. This includes changing from an electrochemical environment to a controlled printing and drying/curing process, which prevents surface damage while maintaining silver deposition functionality.

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If masking is used to protect areas from silver deposition, then selective silver deposition is achieved, but complex masking processes are required and holes still form

Engineering Contradiction:

Improveselective silver depositionVSAvoidmasking process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies a mask layer to the metal layer before applying the silver-containing paste or ink. The mask layer is specifically positioned to protect areas where silver deposition is not desired. This preliminary masking action, combined with the printing method, achieves selective silver deposition without requiring complex masking processes or subsequent mask removal steps.

Inventive Principle:

Principle #10Preliminary action

3Quantity of substance

If electrochemical deposition is used, then silver contact areas are formed, but metal ions are leached and replaced by silver ions causing holes

Engineering Contradiction:

Improvesilver contact area formationVSAvoidmetal ion leaching

Core Design Contradiction:

Quantity of substanceVSObject-generated harmful factors

Solution Approach 1:

The patent replaces the electrochemical deposition process with a printing process that physically applies silver-containing paste or ink to the metal layer. This substitution eliminates the electrochemical reactions that cause metal ion leaching and replacement, preventing hole formation while still achieving silver contact areas for component bonding.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent avoids the harmful electrochemical reactions by using a printing-based approach. Instead of allowing metal ions to be leached and replaced (which causes harm), the method directly deposits silver material in a controlled manner, converting the potential harm into a beneficial direct deposition process that maintains metal layer integrity.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method achieves high reliability and adhesive strength in the connection between the metal layer and the ceramic body, even under temperature changes, and allows for easy connection of components without surface damage.

Implementation Method 1

a silver ink is applied to an area of the metal layer of the metal-ceramic substrate... wherein the silver ink comprises b1) a silver precursor, wherein the silver precursor is a silver carboxylate... d) decomposing the silver precursor contained in the silver ink to silver

Methodology Applied

Scientific EffectThermal decomposition: Pyrolysis

Data Source

PatentEP4332267B1Method for producing a metal-ceramic substrate

Publication Date: 2025.05.14 HERAEUS ELECTRONICS GMBH & CO KG

AI summary

The present invention relates to a method for producing a metal-ceramic substrate and a metal-ceramic substrate. The method for producing a metal-ceramic substrate having a silver-containing contact area comprises the steps: a) providing a metal-ceramic substrate comprising a1) a ceramic body and a2) a metal layer bonded to the ceramic body over a planar area; b) providing a silver ink comprising b1) a silver precursor and b2) an organic compound that is liquid at room temperature and ambient pressure, wherein the silver content is in the range of 1 to 60 percent by weight, based on the weight of the silver ink; c) applying the silver ink to an area of the metal layer of the metal-ceramic substrate; and d) decomposing the silver precursor contained in the silver ink to silver, obtaining a metal-ceramic substrate having a silver-containing contact area.