Cover Body Heating Unit for Substrate Liquid Processing
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Solution Overview
Problem
Existing substrate liquid processing technologies face challenges in rapidly heating processing liquids without degrading them, leading to inefficient and non-uniform liquid processing due to prolonged heating times and temperature inconsistencies.
Innovation Solution
A substrate liquid processing apparatus with a cover body having a ceiling unit, sidewall unit, and heating unit that covers the substrate, allowing for rapid temperature increase of the processing liquid by adjusting the gap between the substrate and the ceiling unit, and maintaining uniform heating to prevent excessive degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the processing liquid is heated by a heater disposed above the substrate, then the processing liquid temperature can be increased, but the heating time is prolonged causing processing liquid degradation and non-uniform temperature distribution
Solution Approach 1:
A cover body is introduced as an intermediary component between the heater and the substrate. The cover body includes a ceiling unit with a heating unit that directly contacts or closely approaches the processing liquid on the substrate, enabling rapid and uniform heat transfer without prolonged exposure that would cause degradation
Solution Approach 2:
The conventional heater disposed above the substrate is replaced by a heating unit integrated into the cover body's ceiling unit. This substitution allows for more efficient and controlled heating of the processing liquid, achieving rapid temperature increase while maintaining uniformity across the substrate surface
2Manufacturing precision
If the processing liquid is heated for a prolonged period to achieve uniform temperature, then temperature uniformity can be improved, but processing liquid degradation occurs
Solution Approach 1:
The cover body acts as an intermediary heat transfer medium that distributes heat uniformly across the processing liquid through its ceiling unit design, achieving temperature uniformity rapidly without the need for prolonged heating that would compromise processing liquid quality
Solution Approach 2:
The heating parameters are changed by integrating the heating function into the cover body structure, allowing for controlled and uniform heat distribution. This enables achieving the required temperature uniformity (within ±5°C) while minimizing heating time to prevent processing liquid degradation
3Speed
If the heater is positioned close to the substrate for rapid heating, then heating speed increases, but temperature uniformity deteriorates
Solution Approach 1:
The ceiling unit of the cover body is designed with specific structural features that ensure uniform heat distribution across different regions of the substrate. The heating unit within the ceiling unit provides localized heat control, achieving both rapid heating speed and uniform temperature distribution simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables rapid and uniform heating of the processing liquid, reducing degradation and ensuring efficient substrate processing by minimizing temperature inconsistencies and vaporization losses.
Implementation Method 1
a heating unit provided at the ceiling unit and configured to heat the processing liquid on the substrate
Implementation Method 2
heating the processing liquid on the substrate by the heating unit
Data Source
AI summary
A substrate liquid processing apparatus 1 includes a substrate holding unit 52 configured to hold a substrate W; a processing liquid supply unit 53 configured to supply a processing liquid L1 onto a top surface of the substrate W held by the substrate holding unit 52; and a cover body 6 configured to cover the substrate W. Here, the cover body 6 includes a ceiling unit 61 disposed above the substrate W, a sidewall unit 62 downwardly extended from the ceiling unit 61, and a heating unit 63 provided at the ceiling unit 61 and configured to heat the processing liquid L1 on the substrate W. The sidewall unit 62 of the cover body 6 is placed at an outer periphery side of the substrate W when the processing liquid L1 on the substrate W is heated.