Conductive Resin Electrode Composition for Moisture-Resistant Flexibility
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Solution Overview
Problem
Existing conductive resin compositions used for forming electrodes in electronic components, particularly in mobile devices and automobiles, face challenges in providing high moisture resistance and flexibility, which are essential for withstanding harsh environments.
Innovation Solution
A conductive resin composition is developed that includes a metal powder, a resin binder, and an organic solvent, where 20.0% by mass or more of the metal powder is flaky, and 70.0% by mass or more of the resin binder is a silicone resin. This composition enhances moisture resistance and reduces design and manufacturing restrictions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conductive resin composition containing an epoxy resin as the main component of the resin component is used, then flexibility is reduced due to design restrictions
Solution Approach 1:
The patent changes the resin composition parameters to include aromatic heterocyclic resins (polyimide, polybenzimidazole, or polyetherimide) which inherently provide both flexibility and reduced design restrictions. This parameter change eliminates the need for complex blending formulations required by epoxy resin systems, thereby simplifying the overall device design while maintaining adaptability.
Data Source
AI summary
A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a metal powder, a resin binder, and an organic solvent, wherein 20.0% by mass or more of the metal powder is a flaky metal powder, and 70.0% by mass or more of the resin binder is a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.