Conductive Structure Thickness Optimization for Bonding Reliability
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Solution Overview
Problem
The manufacturing of electronic devices faces challenges in achieving reliable connections between bonding pads and conductive structures, as existing conductive structures are either too thin, leading to poor ductility and cracking, or too thick, causing material overflow and stress concentration, which affects the reliability and manufacturing cost of the devices.
Innovation Solution
The electronic device incorporates conductive structures with thicknesses ranging from 10 μm to 30 μm, ensuring sufficient strength and preventing cracking while minimizing material overflow, by using conductive materials like copper, aluminum, or tin, and optimizing their thickness and patterning processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the conductive structure is made thinner to reduce material usage and cost, then the manufacturing cost decreases, but the ductility deteriorates and cracking occurs
Solution Approach 1:
The patent applies parameter changes by optimizing the thickness of the conductive structure to a specific range (10-30 μm) that balances material usage with mechanical strength. This parameter optimization prevents both excessive material consumption and structural failure, resolving the contradiction between cost reduction and ductility maintenance.
2Reliability
If the conductive structure is made thicker to improve strength and prevent cracking, then the reliability improves, but material overflow occurs and stress concentration increases
Solution Approach 1:
The patent resolves this contradiction by precisely controlling the conductive structure thickness within 10-30 μm. This parameter control ensures sufficient structural strength and reliability while preventing material overflow during the bonding process, thereby eliminating stress concentration issues associated with excessive thickness.
3Strength
If the conductive structure thickness is increased to prevent cracking, then the ductility improves, but stress concentration occurs
Solution Approach 1:
The patent addresses this contradiction through parameter optimization, setting the conductive structure thickness within the 10-30 μm range. This optimized thickness provides adequate crack resistance while maintaining uniform stress distribution, preventing the stress concentration that would occur with excessively thick structures.
Data Source
AI summary
An electronic device includes a substrate; a first bonding pad and a second bonding pad disposed on the substrate; an electronic assembly on the substrate; a first conductive structure; and a second conductive structure. The electronic assembly includes a third bonding pad and a fourth bonding pad. The third bonding pad is electrically connected to the first bonding pad by the first conductive structure and the fourth bonding pad is electrically connected to the second bonding pad by the second conductive structure. The thickness of the first conductive structure and the thickness of the second conductive structure are greater than or equal to 10 μm and less than or equal to 30 μm.