Conductive Substrate Sulfurization Resistance via Organic Intermediary
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Solution Overview
Problem
The sulfurization of metal thin wires in conductive substrates used in touch panels, caused by sulfur-containing compounds in the environment, leads to reduced conductivity and malfunction, necessitating a solution for sulfurization resistance.
Innovation Solution
A conductive substrate with a base material and a conductive layer containing a metal thin wire part and a transparent insulating part, where the conductive layer includes a compound represented by Formula (1), such as 2-mercaptobenzimidazole, to enhance sulfurization resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal thin wire is used to form the conductive layer, then high conductivity is achieved, but the metal thin wire undergoes sulfurization reaction in sulfur-containing environments, reducing conductivity and causing malfunction
Solution Approach 1:
An organic compound containing a specific chemical structure (Formula 1) is introduced as an intermediary substance between the metal thin wire and the sulfur-containing environment. This compound preferentially reacts with sulfur sources or forms a protective barrier, preventing sulfur from reaching and reacting with the metal thin wire, thereby maintaining its conductivity and preventing malfunction
Solution Approach 2:
The invention utilizes the reactive nature of the organic compound to convert the harmful sulfurization reaction into a beneficial protective mechanism. The compound either reacts with sulfur to form stable, non-harmful products or creates a sulfur-containing protective layer on the metal surface that prevents further degradation, thus transforming the harmful environmental factor into a protective effect
2Reliability
If the conductive layer is made transparent with insulating parts, then touch panel sensitivity is improved, but the metal thin wire becomes more vulnerable to sulfurization from peripheral sulfur sources
Solution Approach 1:
The organic compound acts as a protective intermediary that surrounds or coats the metal thin wire within the transparent conductive layer. This intermediary layer blocks sulfur diffusion paths from peripheral sources to the metal wire, maintaining both the transparency needed for sensitivity and the chemical protection against sulfurization
Solution Approach 2:
The protective organic compound is specifically applied or positioned at critical locations where the metal thin wire is most vulnerable to sulfurization, such as at wire ends or in regions closest to peripheral sulfur sources. This localized protection maintains overall layer transparency while providing targeted defense against sulfurization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate exhibits improved sulfurization resistance, maintaining conductivity and preventing malfunctions in touch panels despite exposure to sulfur-containing environments.
Implementation Method 1
the conductive layer contains a compound represented by Formula (1)... this sulfur source present around the periphery of the conductive substrate causes a sulfurization reaction of a metal thin wire constituting the wire
Implementation Method 2
causes a sulfurization reaction of a metal thin wire constituting the wire... containing a compound represented by Formula (1)... 2-mercaptobenzimidazole
Data Source
AI summary
A conductive substrate includes a base material and a conductive layer arranged on the base material, in which the conductive layer has a conductive thin wire part containing a metal and a transparent insulating part containing no metal, the transparent insulating part being adjacent to the conductive thin wire part, and the conductive layer contains a compound represented by Formula (1).