Conductive Thread Stitching for Wearable Circuit Integration
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Solution Overview
Problem
Current methods for cloth electronization are complex, environmentally harmful, and lack effective insulation and durability, leading to issues with external interference and the need for frequent replacement of entire garments due to damaged electronic modules.
Innovation Solution
The method involves using a conductive region on electronic modules connected to transmission wires, which are then stitched or glued to a heat melt adhesive film, and subsequently integrated into clothing, without welding, allowing for easy replacement of damaged components and improved insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods use metal boards with tin coating or welding to connect electronic modules and transmission wires, then electrical connection is achieved, but environmental protection requirements are violated and the process becomes complicated
Solution Approach 1:
The patent replaces the mechanical welding and tin coating process with a mechanical stitching system using conductive threads. The conductive threads are sewn through the electronic modules and transmission wires to create electrical connections, eliminating the need for harmful welding processes and tin coatings while maintaining reliable electrical connectivity.
Solution Approach 2:
The patent changes the connection method from metallurgical bonding (welding) to mechanical interlocking (stitching). By transforming the connection mechanism and using conductive threads with appropriate electrical properties, the system achieves reliable electrical connections without environmental harm from traditional welding materials.
2Ease of manufacture
If conventional methods use conductive transmission wires fixed to cloth without proper insulation, then circuit formation is achieved, but the wires are vulnerable to external forces and may fall apart
Solution Approach 1:
The patent implements a nested insulation structure where inner insulating layers wrap around conductive threads, and outer insulating layers provide additional protection. This multi-layer nested insulation system protects the conductive wires from external forces while maintaining circuit functionality, preventing wires from falling apart under stress.
Solution Approach 2:
The patent uses composite structures combining conductive threads with insulating materials. The conductive threads are embedded within insulating layers, creating a composite element that maintains both electrical conductivity and mechanical durability. This composite approach allows the circuit to withstand external forces while remaining easy to manufacture.
3Device complexity
If electronic modules are directly placed on cloth without separate circuit boards, then integration is simplified, but insulation and protection from external interference are insufficient
Solution Approach 1:
The patent uses flexible insulating films and thin insulating layers to wrap around electronic modules and conductive threads. These flexible insulating barriers provide protection from external interference and electrical insulation while maintaining the simplicity of direct integration with the cloth, without requiring rigid circuit boards.
4Ease of operation
If transmission wires are sewn directly to cloth without insulation, then connection is achieved, but the wires contact human skin causing signal interference and blurred signals
Solution Approach 1:
The patent introduces insulating layers as intermediary barriers between the conductive transmission wires and the cloth. These insulating intermediaries prevent direct contact between wires and human skin, eliminating signal interference and blurred signals while maintaining the ease of sewing connection through the use of conductive threads that can be easily stitched.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the electronization process, enhances durability, and prevents external interference, enabling the clothing to function normally under various conditions, including washing, while allowing for easy identification and replacement of faulty components.
Implementation Method 1
heated to a temperature sufficient to melt the adhesive film
Implementation Method 2
the circuit board is then sewn, glued, or heated up and fixed to the cloth used for dresses
Data Source
AI summary
Cloth electronic product, by which physiological information can be examined through cloth, includes a packaging cloth or a heat melt adhesive film as circuit, at least an electronic component, such as resistors, microprocessors and sensing assembly, etc., at least a transmission line to be connected with the conductive region of electronic component. Method of producing a cloth electronic product includes sewing the electronic component on packaging cloth or heat melt adhesive film after being connected with the transmission line, or connecting electronic component with the transmission line during the process of jointing of transmission or sewing of packaging cloth or heat melt adhesive film, and then sewing the packaging cloth on the clothing cloth or integrating the heat melt adhesive film into the packaging cloth or clothing cloth. Original structure of the heat melt adhesive film cannot be viewed and miniaturization effects can be produced.