Lamination Ancillary Operations TRIZ Cases

Perfluoropolyether compounds in the resin provide water and oil repellency to resolve fouling resistance issues.

Stitch conductive threads through electronic modules to integrate circuits into clothing, eliminating harmful tin coating and enabling component replacement.

Segmentation via a protruding section allows rapid separation of the protection layer from brittle base materials, preventing damage during removal.

Segmented composite angular segments form a unitary stator structure that eliminates heavy mechanical fasteners and corrosion while improving fatigue strength.

Perforated polypropylene strips replace bulky thermoplastic cores, reducing weight and assembly complexity while maintaining solvent resistance.

A prepreg limits thermal shrinkage stress to suppress warpage in electronic devices.

A composite web structure combines a nonwoven layer with an apertured film to enable high-quality visual signal printing on absorbent articles.

Epoxy-functional polymer adhesive bonds film to unvulcanized rubber via sulfur cross-linking, preventing low-temperature cracking.

Vacuum-driven resin infusion replaces mechanical fasteners to eliminate air entrapment and reduce aircraft weight during composite reworking.

A controlling module coordinates an adhering roller and a limiting device to bond touch panels to liquid crystal displays with high precision.

Direct heating and clamping remove integrated circuits from display panels without damaging electrodes or causing fractures.

Registration marks on decorative sheets enable precise texture alignment without costly physical prototypes.

Preheating module heats electronic devices to weaken bonding substances, enabling automated extraction while insulated channels minimize heat loss.

Short pulse and infrared lasers cut the substrate and protective film to minimize heat strain and prevent impurity introduction.

A dual-cure structured transfer film replicates nanostructures onto large substrates via interpenetrating polymer networks.

Slit prepreg tape with an attached polymer film liner to prevent fibril formation, air pockets, and misalignment during high-speed winding.

Laser ablation of a sacrificial intermediary removes the catalyst layer cleanly, resolving the trade-off between transfer efficiency and structural complexity.

Ultrasonic soldering joins the connecting device to longitudinal strips, eliminating recess cutting steps and ensuring robust connection durability.

Isolation grooves segment the sensor electrode from pressure seals, preventing hysteretic strain and corrosion for accurate ocean depth measurements.

A multi-layer thermoplastic composite bonds a transparent plastic, a rigid plastic, and a reflective foil to create a durable material.

Mechanical milling replaces chemical etching to remove conducting material, eliminating environmental hazards while maintaining precise layer shaping.

A single expanded polytetrafluoroethylene layer and elastomeric silicone coating reinforce a stent structure.

Selected powder particle size creates an interface above the porous core, preventing penetration and controlling adhesive thickness.

A longitudinal slot exposes the carrier pipe for heat tube placement within pre-insulated piping.

A pressing tool linked to a knife member via a cam mechanism drives relative motion for cutting anisotropic conductive film tape.

Combines acrylic and cellulose ester resins in specific ratios to resolve brittleness and heat resistance trade-offs in polarizing plates.

Plasma and acid treatments modify polyimide surfaces to create patterned adhesion, enabling high-temperature device fabrication without adhesive peeling.

A heat conductive sheet combines thermoplastic and thermosetting fluororesins with particulate carbon to achieve low thermal resistance under pressure.

A reinforcing strip aligns with the longitudinal edge of a masking tape substrate to prevent tearing during removal from coated surfaces.

Tensile stress applied by a moving heated feed module prevents wrinkles in high-curvature composite Z-profiles.

A polymer layer inside a metal lid forms a cavity to reduce moisture interaction and prevent corrosion.

Structured surfaces on foam bodies enable fiber application for three-dimensional reinforcement, avoiding complex manufacturing steps required by planar layers.

Dielectric coatings over metal card layers block electrostatic discharge and short circuits in POS devices while preserving surface aesthetics.

Coil-winding prepositions layers to eliminate repeated handling, reducing material tearing while maintaining joining strength.

An adsorber with inclined vacuum pad portions separates flexible substrates from carrier layers.

Graded adhesion between layers ensures the first member peels before the third, resolving unintended separation sequences in optical laminates.

Foil support prevents electrolyte cracking during pressing, eliminating pinholes to boost power without short circuits.

A cylindrical transfer wheel receives stretched elastic films from spreader devices and aligns them on a flat surface before applying the films to an anvil wheel.

Segmenting the support layer from the adhesive layer allows easy removal without skin damage while maintaining strong device fixation.

A rotatable stripper with a tapering edge and support portion maintains constant roller contact.

A separating device adjusts a crack front line distribution using displacement sensing and down pressing forces.

Automated apparatus with spring-loaded grip and heating device removes pellicles from photolithographic masks.

A motorized hoist pulls a resilient line attached to a carpet gripping means for efficient removal.

Water-soluble films contain slurry and fibers during manufacturing, then dissolve to embed reinforcement while preventing equipment damage.

Preheating the processing target substrate before suction-holding minimizes thermal expansion and particle generation during wafer bonding.

Movable rollers on a flexible chuck regulate cleave propagation speed to eliminate non-uniform thickness variations in silicon-on-insulator wafers.

Alternating copper and refractory metal layers resolve conductivity-strength trade-offs in test needles.

Impressed regions on a laminate board compensate for dissection deviations, ensuring matching bevels and preventing decorative layer damage.

Corona discharge treatment modifies backing surfaces to bond pre-preg materials, eliminating manual cutting errors and wrinkling during complex shape forming.