Electronic Device Component Extraction via Thermal Weakening
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Solution Overview
Problem
Modern electronic devices pose a challenge in extracting valuable components such as CPUs and memory chips from printed circuit boards due to strong bonding substances like solder, making reuse or recycling difficult and costly.
Innovation Solution
A method and system involving preheating the electronic device to a predetermined temperature to weaken the bonding substances, followed by manipulation using an automated extraction arrangement, such as a robotic arm, to physically separate and extract the components, with a conveyor system to minimize heat loss and maintain adhesive softness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If bonding substances are used to bond components to the electronic device, then the components remain securely attached during device operation, but the components become difficult and costly to extract for reuse or recycling
Solution Approach 1:
The patent applies thermal energy to change the temperature parameter of the bonding substance, transforming it from a strong bonded state to a softened state that allows component extraction. The heating system raises the temperature to a predetermined level where the bonding substance loses its strong adhesive properties, enabling easy removal of components without damage.
Solution Approach 2:
The patent performs preliminary heating of the bonding substance before the extraction process. By pre-softening the bonding material through controlled heating, the system prepares the bonding substance in advance to facilitate component removal, making the extraction process easier and more cost-effective.
2Ease of operation
If heating is applied to weaken the bonding substance, then component extraction becomes easier, but energy is consumed and heat loss occurs during the process
Solution Approach 1:
The patent introduces an insulated channel as an intermediary element between the heating system and the external environment. This insulation layer acts as a mediator that reduces heat transfer to the surroundings, minimizing heat loss while maintaining the necessary temperature in the bonding substance for effective component extraction.
Solution Approach 2:
The patent creates a thermally isolated environment using insulation around the heating chamber and channels. This inert thermal environment prevents unwanted heat exchange with the external atmosphere, reducing energy consumption and heat loss during the heating and extraction process.
3Ease of operation
If the electronic device is heated to a predetermined temperature, then the bonding substance softens for extraction, but the heating process consumes energy and time
Solution Approach 1:
The patent applies heating locally and selectively to the bonding substance rather than uniformly heating the entire electronic device. The heating system is positioned to target specific areas where components need extraction, reducing the overall heating time and energy consumption while achieving the necessary softening of the bonding material in the required locations.
Solution Approach 2:
The patent applies just enough heating to achieve the predetermined temperature required for bonding substance softening, without excessive heating. By controlling the heating process to reach only the necessary temperature threshold, the system minimizes heating time and energy consumption while still achieving effective component extraction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and cost-effective extraction of high-value components from electronic devices, preserving their functionality for reuse or recycling while minimizing damage and heat loss.
Implementation Method 1
a preheating module arranged to heat an electronic device having one or more components to a predetermined temperature so as to substantially weaken a bonding substance arranged to bond the one or more components to the electronic device
Implementation Method 2
the conveyor arrangement includes an insulated channel arranged to minimize heat loss of the electronic device
Data Source
AI summary
A method for extracting components includes the steps of heating an electronic device having one or more components to a predetermined temperature so as to substantially weaken a bonding substance arranged to bond the one or more components to the electronic device, and thereafter manipulating the electronic device to extract the one or more components from the electronic device.