Integrated Circuit Removal from Display Panel Using Direct Heating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for removing integrated circuits from liquid crystal display modules are inefficient and prone to damaging the display panel, as they require indirect heating and manual peeling, which can lead to prolonged processing times and risk of electrode fracture.
Innovation Solution
A device and method involving a heating unit that directly contacts the display panel, combined with a retractable clamping component, to efficiently and safely remove integrated circuits by heating and clamping them, utilizing a vacuum chamber for improved heat retention and precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a hot air gun is used to heat the IC indirectly, then the IC can be heated to the desired temperature, but it takes a relative long time to heat the IC, resulting in low efficiency
Solution Approach 1:
A heating plate is introduced as an intermediary tool between the heat source and the IC. The heating plate directly contacts the IC to transfer heat, eliminating the inefficiency of indirect hot air gun heating. This mediator enables controlled, direct thermal transfer while protecting the IC from direct flame or excessive heat exposure.
Solution Approach 2:
The mechanical/manual operation of positioning and heating the IC with a hot air gun is replaced by an automated heating plate system. The heating plate can be precisely positioned and controlled to deliver consistent thermal energy directly to the IC, eliminating the time loss associated with manual positioning and indirect heating.
2Productivity
If a hard object is used to peel off the IC, then the IC can be removed from the display panel, but it is easy to scratch the electrode region or cause fracture, adversely affecting display panel integrity
Solution Approach 1:
The physical state of the bonding adhesive is changed by heating, transforming it from a rigid bonded state to a softened or melted state. This parameter change (temperature increase) reduces the bonding strength between the IC and display panel, enabling easy removal without requiring forceful mechanical peeling that could damage the electrode region.
Solution Approach 2:
The heating plate serves as a mediator that facilitates IC removal through thermal energy transfer rather than direct mechanical force. By heating the bonding adhesive to reduce its adhesion strength, the IC can be gently detached without the need for hard objects that could scratch or fracture the delicate electrode region.
3Temperature
If the IC is heated to high temperature for removal, then the bonding adhesive can be softened for easy peeling, but the display panel may be damaged by excessive heat or prolonged heating
Solution Approach 1:
The heating plate applies heat locally and selectively to the IC and its bonding adhesive area, rather than heating the entire display panel uniformly. This localized heating approach softens the bonding adhesive at the IC interface while keeping the temperature of the surrounding display panel and electrode region within safe limits, preventing heat-induced damage.
Solution Approach 2:
The heating plate acts as a controlled intermediary that delivers thermal energy precisely where needed. It can be designed with specific contact area, temperature control, and heating rate characteristics to soften the bonding adhesive without transmitting excessive heat to the sensitive display panel components, thus mediating between the need for adhesive softening and the risk of panel damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances the efficiency of integrated circuit removal while preventing damage to the display panel, allowing for rapid and secure extraction without risking electrode fractures.
Implementation Method 1
a heating unit configured to contact and heat the display panel
Implementation Method 2
operating within a vacuum chamber to maintain heat and prevent damage
Data Source
AI summary
The present disclosure provides a method and device for removing an integrated circuit. The device is used to remove the integrated circuit from a display panel. The device includes a heating unit configured to contact and heat the display panel, and a retractable clamping-taking component configured to clamp and take the integrated circuit on the display panel which has been heated. According to embodiments of the present disclosure, the method and device may remove the integrated circuit from the display panel without destroying the display panel and increase efficiency of removing the integrated circuit.