Polyimide Film Bonding via Patterned Coupling Layer
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Solution Overview
Problem
Conventional methods for forming functional devices like semiconductor, MEMS, and display devices on polyimide films face challenges due to insufficient heat resistance and dimensional stability of polyimide films, as well as inadequate bonding between polyimide films and inorganic substrates, leading to issues like peeling and stress accumulation during high-temperature processing.
Innovation Solution
A method involving plasma treatment and acid treatment of polyimide films, combined with coupling agent treatment and inactivation of the coupling layer to create distinct adhesion and peeling patterns, allowing for strong adhesion during device fabrication and easy peeling after processing, without the need for additional adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional adhesives or pressure-sensitive adhesives are used to bond polyimide film to inorganic substrate, then bonding is achieved, but heat resistance is insufficient for high-temperature processing (200-500°C)
Solution Approach 1:
The invention removes the adhesive layer from the bonding structure, achieving direct bonding between the polyimide film and inorganic substrate through surface treatment alone, thereby eliminating the heat resistance limitation of conventional adhesives
Solution Approach 2:
The invention changes the surface parameters of the polyimide film and/or substrate through plasma treatment and acid treatment, creating surface characteristics that enable direct thermal bonding without adhesives, allowing the structure to withstand high processing temperatures
2Temperature
If polyimide film is directly bonded to inorganic substrate without adhesive, then heat resistance is improved, but bonding strength is insufficient
Solution Approach 1:
The invention modifies surface parameters through plasma treatment and acid treatment to create highly reactive surface groups that form strong chemical bonds with the opposing surface, achieving bonding strength sufficient for high-temperature processing without adhesives
Solution Approach 2:
The invention creates a composite surface structure combining treated polyimide film and inorganic substrate with complementary surface properties, achieving both strong bonding and heat resistance through the synergistic effect of the treated interfaces
3Ease of operation
If polyimide film is used as substrate for device fabrication, then flexibility and thin-film formation are achieved, but dimensional stability is insufficient during high-temperature processing
Solution Approach 1:
The invention nests the polyimide film within a rigid inorganic substrate framework through direct bonding, allowing the flexible film to maintain its operational flexibility while the rigid substrate provides dimensional stability during high-temperature processing
Solution Approach 2:
The invention applies differential properties to different parts of the structure: the polyimide film maintains flexibility and thin-film characteristics where needed, while the inorganic substrate provides rigidity and dimensional stability in regions requiring thermal stability
4Strength
If adhesive layer is used between polyimide film and substrate, then bonding is achieved, but peeling occurs during high-temperature processing
Solution Approach 1:
The invention extracts and eliminates the adhesive layer from the bonding structure, achieving direct bonding between polyimide film and substrate that maintains both bonding strength and peeling resistance under high-temperature conditions
Solution Approach 2:
Instead of using an intermediate adhesive layer to achieve bonding, the invention inverts the approach by directly bonding the film and substrate through surface treatment, thereby eliminating the weak link that causes peeling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the formation of devices on polyimide films with improved heat resistance and dimensional stability, allowing for precise positioning and multilayer fabrication without peeling issues, even at high temperatures, and facilitates easy peeling post-fabrication, enhancing the reliability and efficiency of electronic device production.
Implementation Method 1
a laminate constituted of a thin polyimide film excellent in heat resistance and insulation properties and a substrate made of an inorganic substance
Implementation Method 2
a substrate made of an inorganic substance (e.g., one kind selected from a glass plate, a ceramic plate, a silicon wafer, and a metal plate) having a coefficient of thermal expansion which is substantially the same as that of the polyimide film
Data Source
AI summary
The invention provides a laminate of a substrate, a polyimide film, and a coupling treatment layer interposed therebetween, which provides different delamination strengths between the substrate and the polyimide film to form a prescribed pattern. The invention also provides a method for producing such a laminate formed from at least a substrate and a polyimide film, whereby, using a film obtained by plasma treatment of at least the surface facing the substrate as the polyimide film, coupling agent treatment is performed on at least one of the surfaces facing the substrate and the polyimide film to form a coupling treatment layer, deactivation treatment is performed on a portion of the coupling treatment layer to form a pre-determined pattern, and then pressing and heating are performed with the substrate and polyimide film overlapping.