Conductive Transfer Layering for Flexible Thermoplastic Substrates
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Solution Overview
Problem
Conventional transfer printing processes using thermoplastic polymers for conductive transfers result in increased hardness and reduced flexibility due to repeated curing and drying, limiting their suitability for complex, multi-layered electronic products.
Innovation Solution
A method involving printing non-conductive and electrically conductive inks on a release film, followed by curing and application to a thermoplastic polymer substrate using heat and pressure, allowing the adhesive layer to adhere, thereby forming a conductive transfer with multiple layers without direct exposure to curing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If printed layers are applied directly onto a thermoplastic polymer substrate with repeated curing and drying processes, then the conductive transfer achieves electrical functionality, but the substrate repeatedly melts and solidifies thereby increasing in overall hardness and losing flexibility
Solution Approach 1:
The invention segments the manufacturing process into two distinct phases: first, printing and curing conductive ink layers on a release film to achieve electrical functionality; second, bonding the pre-cured conductive layers to the thermoplastic polymer substrate. This segmentation prevents the substrate from undergoing repeated melting and solidifying cycles, thereby maintaining flexibility while achieving reliable electrical functionality.
Solution Approach 2:
The conductive ink layers are printed and cured in advance on the release film before being bonded to the thermoplastic polymer substrate. This preliminary action allows the curing process to occur independently of the substrate, preventing the substrate from experiencing repeated thermal cycles that would cause hardness increase and flexibility loss.
2Reliability
If multiple printed layers are applied directly onto the substrate, then the conductive transfer achieves increased electrical functionality, but the substrate must withstand repeated applications of printing, curing and drying which limits material choice
Solution Approach 1:
The invention separates the conductive layer fabrication process from the substrate application process. Multiple conductive ink layers are printed and cured on a release film independent of the substrate material constraints. This segmentation allows a broader range of thermoplastic polymer substrates to be used without limiting the substrate's ability to withstand repeated curing cycles, as these cycles occur on the release film rather than the substrate.
3Strength
If conventional transfer printing processes are used with thermoplastic polymers, then the substrate provides structural support, but the repeated curing processes increase overall hardness and reduce flexibility
Solution Approach 1:
The conductive ink layers are printed and cured in advance on the release film before bonding to the thermoplastic polymer substrate. This preliminary curing action prevents the substrate from undergoing repeated thermal cycles, allowing the substrate to maintain its flexibility while still providing necessary structural support for the conductive transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of thermoplastic polymers in conductive transfers by maintaining flexibility and functionality, facilitating the production of complex electronic products with increased electrical functionality and durability.
Implementation Method 1
applying at least one of heat or pressure to said first substrate and said release film such that said adhesive layer adheres to said first substrate
Implementation Method 2
applying at least one of heat or pressure to said first substrate and said release film
Implementation Method 3
applying at least one of heat or pressure to said first substrate and said release film
Data Source
AI summary
A method of manufacturing a conductive transfer, comprises the step of printing a non-conductive ink onto a release film to produce a first non-conductive ink layer and curing the first non-conductive ink layer. The method comprises printing an electrically conductive ink onto the first non-conductive ink layer to produce an electrically conductive ink layer and curing the electrically conductive ink layer; and printing a non-conductive ink over the electrically conductive layer to produce a second non-conductive ink layer and curing the second non-conductive ink layer. An adhesive material is printed over the second non-conductive ink layer to produce an adhesive layer and the adhesive layer is cured. The release film comprising the first non-conductive ink layer, electrically conductive ink layer, second non-conductive ink layer and adhesive layer is applied to a first substrate and at least one of heat or pressure is applied to the first substrate and release film such that the adhesive layer adheres to said first substrate. The first substrate comprises a thermoplastic polymer.