Decorative Surface Effects TRIZ Cases

Selective wet etching of vertically aligned metal-nitride composites forms distributed sub-10 nm nanoholes for reusable plasmonic sensing.

Protruding scribe lines and edge lines increase wafer tension to limit warpage and delamination during MEMS-CMOS wafer handling.

See how epoxy encapsulation shields a corrodible four-sided MEMS structure from moisture and debris while preserving a sealed cavity.

Hydrophobic and hydrophilic covalent modifications differentiate microfluidic flow and isolation regions for biomaterial handling.

Offset inlet and coupling holes route fluid through a buried cavity, reducing clogging and particle access to the sensing element.

Anisotropic ion etching builds deep silicon holes, while wet etching reshapes walls for high-aspect-ratio microneedles.

This case uses detachable cover blocks, varied shapes, and adapters to expand pixel detail, repositioning, and three-dimensional expression.

This case integrates CMOS and MEMS IR sensors with an IR-transparent cap to create a wafer-level vacuum cavity for compact packaging.

Continuous metallic seals formed by electroless plating reduce leak rates and moisture ingress at stacked microelectronic bond joints.

A gel-encapsulated sensor uses a metal cover and plastic overmoulding to seal and withstand high-temperature, high-pressure service.

An off-axis silicon wafer mold shapes borosilicate glass, enabling controlled angles and fewer bright spots in MEMS image areas.

Laser bonding and particle-jet cutting create robust transparent hermetic packages.

This case uses sulfur plasma activation before molecular adhesion to limit pimple defects while preserving bonding energy.

This case uses bonded glass deformation regions to incline or shift optical elements with flexible, high-quality production.

This case uses a clamped book cover and block with angled laser ablation to create tamper-evident edge security features.

Transparent areas let one film reveal static motifs or dynamic display content.

This case uses a 100–300°C silicone die to emboss plastic surfaces, reducing mold, solvent, ink, and carrier-film complexity.

This case forms lower edge areas before dividing thermoplastic decorative panels for precise profiles, less waste, and lower noise.

A deposited thin film, through holes, and sealing layer create MEMS cavities without CMP, improving sealing reliability.

Ultrashort pulse lasers guide organic alkaline etching to create precise glass channels and complex structures at elevated temperatures.

This case uses carrier tape to transfer and align gas-permeable film, avoiding suction deformation for flatter, more reliable attachment.

Deep-cavity lithography can disrupt array uniformity; deposited layers planarize the cover before etching for better IR transmittance.

Wafer circulation holes route cleaning liquid during wet cleaning, reducing movable-portion damage while removing foreign substances.

A stencil, citrus-based gel, and controlled low heat separate pigmented layers for affordable metal etching without laser equipment.

A urethane binder, 4–20 μm beads, and nanosilica help retain a ≤5 GU low-gloss surface during film stretching.

Wafer-level cavity formation and hermetic bonding reduce MEMS mirror package size, signal noise, and reflection interference.

All-SiC MEMS sensing isolates pressure measurement from acceleration interference.

Vapor HF releases BEOL metal MEMS structures for CMOS-scale production.

A fixed-free die package decouples substrate CTE mismatch from MEMS flexure stress, limiting temperature-driven frequency shifts.

This case uses dummy patterns in the eutectic bonding region to improve uniformity, protect sensor elements, and preserve connectivity.

This MEMS case uses protective material and a base plate as chemical stops to limit adhesion-layer attack during etching.

This case uses low-temperature metal deposition to hermetically seal MEMS oxide-release vents without degrading heat-sensitive materials.

Capacitive sensing of resonant-frequency shifts delivers compact temperature measurement with a high 64.7 Hz/°C TCF.

Catalytic chemical vapor deposition builds silicon columns, while anisotropic etching removes material between them without masking.

A cover glaze with coloring metal oxides and roller printing solves monotonous ceramic decoration with iridescent cloud effects.

A master form with rim protrusions enables precise, rapid microfluidic sealing without channel deformation or adhesive films.

Two-peak epoxy layering distributes stress in MEMS packages to reduce glass cracking.

This case integrates solidified molding material around a chip to absorb shocks and maintain force-sensing movement in compact packages.

Printing and curing conductive layers on a release film avoids repeated thermal cycles in flexible thermoplastic substrates.

This case uses topographic cavity features and conformal anti-stiction layers to limit membrane contact, charge retention, and collapse.

Alternating tensile metal and compressive dielectric layers create MEMS springs that resist vibration in three directions.

This decorative substrate uses annular grating grids to converge reflected light, creating vivid 3D woven patterns on covers.

Acrylic resin and blocked isocyanate balance vacuum-forming flexibility with post-cure hardness and wear resistance.

A wafer-bonded CMUT structure uses partially buried isolation posts to reduce charge trapping and parasitic capacitance.

A compliant polymeric sheet spreads press force across wood veneer, preserving natural embossing and improving thermosetting binder curing.

Pre-applied 3D forming elements align tactile structures with decorative plies, reducing mold changes for varied plastic articles.

Selective laser and chemical etching create high-aspect trenches while reducing thermo-elastic damping in fused silica inertial MEMS.

Silicon nitride and metal barrier layers limit hydrogen and helium ingress, helping preserve MEMS cavity pressure stability.

Process variation can unbalance MEMS cavity pressure; lateral fluid channels connect neighboring cavities for more consistent sensitivity.

Controlled pressing, heating, holding, and cooling help glass container decals resist peeling, bubbles, and environmental wear.