Wafer-Level Vacuum Packaging for Compact Thermal Imaging Sensors

The patent replaces mechanical shutters and calibration components with an electronic calibration system. The microbolometer array is integrated with CMOS readout circuitry that performs offset correction and calibration through electrical signals rather than mechanical movement. This eliminates moving parts while maintaining the IR detection function, directly resolving the contradiction between reliability and manufacturing complexity.

The patent merges the calibration function with the main IR detector body by integrating the CMOS readout circuitry directly with the microbolometer array on the same substrate. This consolidation eliminates separate calibration mechanisms and reduces the number of discrete components, thereby reducing manufacturing cost while maintaining calibration functionality through electronic control.

The patent applies preliminary action by performing wafer-level packaging before singulation of individual devices. Multiple microbolometer arrays are packaged together in a single vacuum encapsulation process on the wafer level, rather than packaging each chip individually after切割. This preliminary packaging action significantly increases productivity by processing multiple devices simultaneously and reduces labor intensity.

The patent replaces bulky mechanical optical focusing components with a planar microlens array fabricated directly on the detector surface. This optical element is integrated into the device plane rather than requiring three-dimensional mechanical assemblies. The microlens array provides sufficient focusing capability for compact applications while dramatically reducing the overall device volume and eliminating complex mechanical adjustment mechanisms.