Semiconductor Package Structure for Shock Absorption and Parameter Control
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Solution Overview
Problem
Existing semiconductor package structures face challenges in controlling parameters and absorbing shock impacts, especially as semiconductor technology advances and package sizes shrink, leading to issues with signal accuracy and reliability during reliability tests.
Innovation Solution
The introduction of a molding material that surrounds the chip, which can be injected in a gel or liquid form and solidified, providing shock absorption and protection, with adjustable amounts to meet specific shock resistance needs, and optionally combined with a housing for additional protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If package structure is shrunk to advance semiconductor technology, then miniaturization is achieved, but control of parameters inside the package becomes difficult
Solution Approach 1:
The patent applies preliminary action by forming a recess in the substrate before mounting the semiconductor device, and pre-positioning the molding material in this recess. This preliminary structural preparation creates dedicated space and controlled environment that enables precise control of internal parameters even in shrunk packages, resolving the contradiction between miniaturization and parameter control.
2Reliability
If molding material is added to absorb shock impact, then reliability is improved, but package structure complexity increases
Solution Approach 1:
The patent merges the shock absorption function with the existing substrate and molding material structure. The molding material is integrated into a recess formed in the substrate, combining structural support, shock absorption, and device mounting functions into a unified structure. This reduces overall package complexity while improving reliability through enhanced shock resistance.
3Ease of manufacture
If molding material is injected in gel or liquid form, then ease of manufacture is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes parameter changes by injecting molding material in gel or liquid form (low viscosity state) for easy manufacturing, then controlling its solidification process to achieve precise dimensional stability. The temperature and chemical parameters during solidification are controlled to ensure accurate formation of the package structure, resolving the contradiction between ease of injection and precision of final form.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed semiconductor package structures effectively absorb shock impacts, ensuring reliable operation and passing reliability tests, while allowing for the movement of movable elements within cavities for sensing or outputting forces.
Implementation Method 1
The molding material that surrounds the chip can be injected in a gel or liquid form and solidified, providing shock absorption and protection
Data Source
AI summary
The present disclosure provides a semiconductor package structure and a manufacturing method thereof. The semiconductor package structure includes: a substrate; a chip disposed on the substrate; and a molding material disposed on the substrate and surrounding the chip. The chip includes: a cavity; and a movable element disposed within and movable within the cavity and configured to sense or output a force.