Transparent Hermetic Packages With Laser Bonding and Rounded Edges
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Solution Overview
Problem
Existing hermetically sealed packages face challenges in withstanding adverse environmental conditions, mechanical loads, and ensuring robustness while allowing for transparency and customizable external shapes, with conventional methods being inefficient and costly.
Innovation Solution
A method involving laser bonding of transparent substrates to form hermetically sealed packages with angled, rounded edges, using particle jets for abrasive cutting to create customizable cavities, and laser welding for sealing, allowing for efficient production of multiple packages from a wafer stack.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional hermetically sealed packages are used, then protection against environmental conditions is provided, but robustness against mechanical loads and adverse environmental influences is insufficient
Solution Approach 1:
The package combines multiple materials with complementary properties: transparent substrate (glass or transparent ceramic) provides hermetic sealing and environmental protection, while the intermediate substrate (ceramic or metal) provides mechanical strength and thermal stability. This composite structure resolves the contradiction by integrating the protective function of hermetic sealing with the mechanical robustness of ceramic or metal substrates.
2Illumination intensity
If transparent substrates are used for hermetic sealing, then transparency for communication and measurement is enabled, but mechanical strength and resistance to environmental impacts are reduced
Solution Approach 1:
The package uses a composite structure where the transparent substrate (glass or transparent ceramic) provides hermetic sealing and optical transparency for communication and measurement, while the intermediate substrate (ceramic or metal) provides mechanical strength and structural support. This resolves the contradiction by distributing functional requirements across different materials.
Solution Approach 2:
The package is divided into multiple functional substrates: a transparent substrate for hermetic sealing and optical access, and an intermediate substrate for mechanical support. This segmentation allows each substrate to be optimized for its specific function, resolving the contradiction between transparency and mechanical strength.
3Productivity
If conventional dicing methods are used, then package production is achieved, but breakouts at corners and edges occur reducing robustness
Solution Approach 1:
The package design incorporates rounded corners and edges instead of sharp angles. This curvature eliminates stress concentration points that would otherwise lead to breakouts during dicing and handling, resolving the contradiction between production efficiency and robustness by preventing defects before they occur.
4Adaptability or versatility
If multiple materials and bonding materials are used, then package functionality is enhanced, but material complexity and cost increase
Solution Approach 1:
The package structure merges the functions of multiple components into an integrated multi-layer substrate system. The transparent substrate, intermediate substrate, and bonding layers are combined into a unified hermetically sealed structure, reducing the need for separate bonding materials and assembly steps while maintaining material versatility for different application requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances package robustness against environmental impacts, reduces material usage, and enables cost-effective, durable production of packages with customizable shapes and transparent areas for communication and measurement, while minimizing material waste.
Implementation Method 1
The particle jet is directed onto the transparent substrate in such a way that material is ablatively removed from the transparent substrate
Implementation Method 2
using particle jets for abrasive cutting to create customizable cavities
Implementation Method 3
laser welding for sealing
Data Source
AI summary
A method for providing a plurality of hermetically sealed packages, including the steps of: providing at least two substrates including a first substrate and a second substrate, at least one of the at least two substrates being a transparent substrate, the two substrates being arranged directly adjoining each other or on top of one another, the transparent substrate defining a circumferential rim and an upper side of each package, the bottom of the package being defined by the second substrate, a respective contact area being defined at contact surfaces between the two substrates; sealing each functional area in a hermetically tight manner by bonding the two substrates along the contact area of each package; and dicing each package by a cutting step or a separating step, a particle jet being used to abrasively remove a material from the transparent substrate by the particle jet.