Supply Conductor Assembly Encapsulation With Liquid Sheathing
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Solution Overview
Problem
Existing methods for producing arrangements covered with wrapping material from pension managers are complex and difficult to automate, with high material consumption and the need for various recording cavities for different forms of pension managers.
Innovation Solution
A procedure involving the application of a liquid wrapping material in a continuous or quasi-continuous strand to envelop pension managers, which can be automated and efficient in terms of material usage, without the need for complex system structures or manual insertion into molds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive tape wrapping is used to bundle and protect supply conductors, then the conductors are protected from mechanical and climatic influences, but the process becomes complex and difficult to automate
Solution Approach 1:
The patent changes the physical state of the wrapping material from solid adhesive tape to liquid encapsulating material that can be injected and then solidifies. This parameter change (from solid to liquid state) enables automated injection molding processes while maintaining the protective function against mechanical and climatic influences.
Solution Approach 2:
The patent replaces the mechanical wrapping process with adhesive tape with an injection molding process using liquid material. This substitution eliminates the complexity of handling and applying adhesive tape while achieving the same protective effect through a more automatable injection and solidification process.
2Reliability
If adhesive tape wrapping is used for arrangements with a large number of supply conductors, then protection is achieved, but the process becomes even more complex and difficult to automate
Solution Approach 1:
The patent replaces the manual or semi-automated adhesive tape application process with an automated injection molding system. The liquid encapsulating material is injected automatically into the mold cavity containing the conductor bundle, and the subsequent solidification process is fully automatable, significantly improving the extent of automation for protecting large conductor bundles.
Solution Approach 2:
The injection molding process serves multiple functions simultaneously: it positions the conductors, provides mechanical protection, and offers climatic protection all in one automated operation, whereas adhesive tape wrapping would require multiple separate operations for each function.
3Manufacturing precision
If supply conductors are inserted into receiving cavities of molds for overmolding, then encapsulation is achieved, but manual insertion is required to ensure correct positioning
Solution Approach 1:
The patent employs self-positioning features where the supply conductors themselves have positioning elements that automatically engage with corresponding features in the mold cavity. This self-service mechanism ensures correct positioning without requiring manual insertion, as the conductors position themselves during the automated injection process.
Solution Approach 2:
The mold cavity is pre-configured with positioning elements and receiving features before the injection process begins. The supply conductors are designed with complementary positioning elements that automatically align and engage with these pre-prepared features, ensuring correct positioning is achieved automatically as part of the injection process rather than requiring separate manual positioning steps.
4Manufacturing precision
If large quantities of encapsulating material are injected into the mold, then desired encapsulation of supply conductors is achieved, but material consumption becomes high
Solution Approach 1:
The patent changes the viscosity and flow characteristics of the encapsulating material to optimize the injection process. By controlling the material parameters (viscosity, flow rate, injection pressure), the liquid material can achieve complete and precise encapsulation of the supply conductors with minimal excess material, reducing waste while ensuring desired encapsulation quality.
Solution Approach 2:
The injection process is controlled to provide just enough material to achieve complete encapsulation without excessive overfilling. The injection volume and pressure are precisely controlled to match the cavity volume requirements, ensuring adequate encapsulation protection while minimizing material consumption and waste.
5Adaptability or versatility
If a large number of different receiving cavities are used for different supply conductor shapes, then various conductor configurations can be accommodated, but the number of required molds increases
Solution Approach 1:
The patent designs the mold cavity with universal, adjustable features that can accommodate different supply conductor shapes and configurations. The positioning elements and cavity geometry are designed to be adaptable rather than fixed for specific shapes, allowing a single mold design to serve multiple conductor types, thereby reducing the total number of different receiving cavities needed.
Solution Approach 2:
The mold cavity incorporates dynamic or adjustable elements that can be reconfigured for different conductor shapes. Rather than requiring separate fixed cavities for each conductor type, the cavity can be adjusted or repositioned to accommodate various shapes, making the system more versatile and reducing the number of different receiving cavities required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The procedure enables the efficient and automated production of arrangements covered with wrapping material, reducing material consumption and simplifying the process, while maintaining high efficiency and precision.
Implementation Method 1
The liquid sheathing material can solidify after application to the supply conductor(s) of the arrangement, in particular through self-initiated or externally initiated chemical and/or physical mechanisms, and form a solid sheath after solidification
Data Source
Figure 1~2
AI summary
Method and apparatus (10) for manufacturing an arrangement (30) enclosed with a covering material (20) consisting of at least one supply conductor (31).