Configurable Capacitor with Interconnect Structure for Low ESR
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Solution Overview
Problem
The miniaturization of electronic circuits requires high-density, small-footprint capacitors with low Equivalent Series Resistance (ESR) and Equivalent Series Inductance (ESL) that are difficult to achieve with discrete capacitors stacked on printed circuit boards, leading to poor capacitor characteristics and wasted space.
Innovation Solution
A configurable capacitance device with a semiconductor substrate and a separate interconnect structure that allows for the electrical coupling of multiple integrally formed capacitors in parallel or series configurations, providing flexible capacitance values and reducing ESR and ESL.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple discrete capacitors are stacked on a printed circuit board, then the required capacitance value can be achieved, but the circuit footprint increases and board space is wasted
Solution Approach 1:
Multiple capacitors are integrated into a single semiconductor device, combining multiple capacitor elements into one unified component that can be placed as a single footprint on the circuit board, thereby reducing the overall area occupied while maintaining the required total capacitance
Solution Approach 2:
The semiconductor device provides multiple capacitor elements with different capacitance values that can be selectively activated or configured, allowing a single component to serve multiple capacitance requirements that would otherwise need separate discrete capacitors
2Quantity of substance
If multiple discrete capacitors are stacked on a printed circuit board, then the required capacitance value can be achieved, but the overall capacitor characteristics deteriorate
Solution Approach 1:
Multiple capacitor elements are fabricated together on a single semiconductor substrate with integrated interconnections, ensuring consistent electrical characteristics and reducing parasitic effects that occur with discrete stacked capacitors, thereby improving overall capacitor performance and reliability
3Quantity of substance
If multiple discrete capacitors are used, then the required capacitance value can be achieved, but manufacturing costs increase
Solution Approach 1:
Multiple capacitor elements are fabricated simultaneously on a single semiconductor substrate using standard semiconductor manufacturing processes, allowing batch production that reduces per-unit costs compared to assembling multiple discrete capacitors, thereby lowering manufacturing costs while achieving the required total capacitance
4Ease of manufacture
If discrete capacitors are used with finite spacing, then manufacturing is simplified, but board space efficiency decreases
Solution Approach 1:
Multiple capacitor elements are integrated into a single semiconductor package with internal interconnections, eliminating the need for finite spacing between discrete capacitors on the board, thereby maximizing board space efficiency while maintaining manufacturing simplicity through standard integration processes
Data Source
AI summary
A configurable capacitance device includes a semiconductor substrate including a plurality of integrally formed capacitors; and a separate interconnect structure coupled to the semiconductor substrate, wherein the separate interconnect structure is configurable to electrically couple two or more of the plurality of integrally formed capacitors together in a parallel configuration.