Configurable LED Circuit Layout for Multi-Size Substrates
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Solution Overview
Problem
The existing manufacturing process for LEDs requires separate circuit board designs and stock-keeping units (SKUs) for each unique LED device due to geometric differences, leading to increased manufacturing costs and inventory management challenges, as larger LEDs need larger circuit pads and higher voltages.
Innovation Solution
A configurable LED circuit layout on a substrate with multiple sets of electrical traces and peripheral solder pads allows for electrical connection and voltage supply to different sized LEDs, reducing the number of required SKUs by enabling a single SKU to accommodate various LED sizes and voltages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate circuit board designs are created for each LED device size, then each LED size can have optimized circuit pads and voltage configurations, but the number of SKUs increases and manufacturing costs increase
Solution Approach 1:
The circuit board is designed with multiple sets of electrical traces (first set, second set, third set) that can be selectively activated to support different LED sizes and voltage requirements. The board can function as a universal platform that adapts to various LED configurations through selective use of different trace sets and solder pad combinations, eliminating the need for multiple specialized board designs.
Solution Approach 2:
The circuit board incorporates configurable electrical connections where the effective circuit layout can be dynamically adjusted based on the LED size being mounted. Larger LEDs can utilize larger solder pads and different trace configurations, while smaller LEDs use corresponding smaller pads and traces. This dynamic reconfiguration capability allows a single board design to serve multiple LED size categories.
2Reliability
If separate circuit board designs are created for each LED device size, then each LED size can have optimized electrical connections, but manufacturing costs and inventory management complexity increase
Solution Approach 1:
A single circuit board design incorporates multiple sets of electrical traces and solder pads that can accommodate different LED sizes. The first set of electrical traces with first solder pads serves smaller LEDs, while the second set with second solder pads serves larger LEDs. This universal design eliminates the need to manufacture and stock multiple specialized board variants, reducing manufacturing costs and inventory complexity while maintaining optimized electrical connections for each LED size category.
3Ease of manufacture
If a single circuit board design is used for all LED sizes, then manufacturing cost and inventory complexity decrease, but the board cannot accommodate different LED sizes and voltage requirements
Solution Approach 1:
The circuit board is segmented into multiple independent electrical trace sets (first set, second set, third set) with corresponding solder pads of different sizes and configurations. Each segment can be independently activated depending on the LED size being mounted. This segmentation allows the single board design to adapt to different LED sizes and voltage requirements while maintaining cost-effective manufacturing and inventory management.
Solution Approach 2:
The circuit board utilizes multiple layers or dimensions of electrical traces, with different trace sets positioned at different locations or layers. This dimensional arrangement allows the board to provide different electrical connection configurations for different LED sizes without requiring physically separate boards, thereby achieving versatility while maintaining a single SKU.
Data Source
AI summary
A device for an LED has a substrate and a circuit on the substrate configured to accept the LED. The circuit includes a first set of electrical traces terminating at a first set of solder pads for a first sized LED, a second set of electrical traces terminating at a second set of solder pads for a second sized LED different from the first sized LED, and peripheral electrical traces for electrically interconnecting electrical traces of the first set of electrical traces or between electrical traces of the second set of electrical traces. Connection components electrically interconnect the first set of electrical traces with each other or the electrical traces of the second set of electrical traces with each other, respectively, at corresponding solder pads. The device is configurable to provide a first voltage and a second voltage to the LED.