Configurable Substrate with Interconnection Matrix for SIP
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Solution Overview
Problem
Conventional System-In-Package (SIP) devices require unique custom substrates for each system, leading to high costs and longer cycle times, which hinder low-volume production and rapid prototyping, especially in applications needing miniaturization and integration of diverse device technologies.
Innovation Solution
A configurable system using multiple SIP subsystems with an interconnection matrix that allows for re-configurable connections between components, enabling the creation of a standard substrate for multiple subsystems with programmable interconnections, suitable for harsh environments like downhole oil and gas applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional SIP devices use custom substrates for each system, then system functionality and integration are achieved, but design and manufacturing costs increase and cycle times lengthen
Solution Approach 1:
The patent applies universality by creating a standardized substrate design that can accommodate multiple different SIP subsystems and configurations. The substrate includes reusable interconnection matrices and connection pads that can be programmed through wire bonding to create different system architectures, eliminating the need for custom substrates for each system while maintaining full functionality.
Solution Approach 2:
The patent segments the substrate into modular components including interconnection matrices, connection pads, and subsystem mounting areas. This segmentation allows different portions of the substrate to be independently configured for different applications through selective wire bonding, enabling a single substrate design to serve multiple system requirements.
2Adaptability or versatility
If conventional SIP devices use custom substrates for each system, then system integration is achieved, but manufacturing cycle times increase
Solution Approach 1:
The patent applies preliminary action by pre-configuring the substrate with standardized interconnection matrices, connection pads, and mounting structures before subsystem assembly. The substrate is prepared in advance with all necessary electrical pathways and mechanical features, so that during manufacturing, subsystems can be quickly placed and interconnected through wire bonding without requiring custom substrate fabrication for each system.
3Reliability
If conventional SIP devices use custom substrates, then specific system requirements are met, but scalability to low volume production is hindered
Solution Approach 1:
The patent applies parameter changes by maintaining a constant substrate design while varying the interconnection parameters through wire bonding configurations. The same substrate can be programmed with different connection patterns to meet various system requirements, allowing low-volume production of customized systems using a standardized manufacturing process that doesn't require expensive custom substrate tooling for each configuration.
Data Source
AI summary
Systems and devices for enabling the use of SIP subsystems to make a configurable system having a unique interconnecting scheme creates appropriate connections between the SIP components and/or subsystems such that desired characteristics and features for the configurable system are provided.