Printed Circuit Assembling TRIZ Cases

A laminated electronic component uses a conductive elastic structure connected to external electrodes at corner portions to attenuate vibration.

Distinct masking elements join strongly to resin rather than support, preventing visual access to the active face during mechanical attacks.

Photoresist-formed pads on a reinforcing plate align space transformers, preventing reflow soldering shifts that reduce mechanical strength.

A three-dimensional measurement device adjusts imaging sensor height to maintain focus on measured objects.

Dispersing InAgCu intermetallic phases within solder matrices resolves the contradiction between low melting temperatures and poor mechanical strength.

A transparent substrate alignment method uses regularly arranged conductive particles to expose mark edges for precise camera detection.

Placing passive devices within via structures reduces planar footprint while converting thermal resistance into conductive heat dissipation pathways.

Single-piece backup block eliminates assembly tolerances to resolve height accuracy trade-offs in screen printing.

Embedding a carrier plate in a hybrid core supports stack formation, reducing warpage during large-panel manufacturing.

Conductive substrate traces form a Faraday cage around the die to provide electromagnetic interference shielding.

A surface-modified light-absorbing epoxy flux film integrates optical absorption with soldering and sealing functions in a single layer.

Polybutadiene acrylate flux composition prevents residue cracking during thermal cycling while maintaining solder wettability in air atmosphere.

Automated suction mechanisms handle miniaturized components to eliminate static damage risks while maintaining sub-millimeter positioning accuracy.

A touch device replaces mechanical switches in hair styling tools with a sensing shell, flexible circuit board, and rigid printed circuit board.

Segmented contactors with elastic prongs retain bulbous terminals under vibration without complex clamping mechanisms.

Segmented conductive blocks with integrated support legs reduce horizontal footprint on compact printed circuit boards while maintaining mechanical stability.

Conductive adhesive anchors electronic components to substrates at specific points, preventing reflow shifting while maintaining cost efficiency.

A mounting machine uses a squeegee mechanism to transfer viscous fluid to component bumps with precise film thickness control.

A press-fit plug connects stacked printed circuit boards without soldering to simplify assembly.

A mounter detects nozzle tray height to prevent mounting head interference.

A disk drive microactuator uses a piezoelectric element with selective peripheral encapsulation to enable precise head positioning.

A funnel-shaped hole in a second substrate bridges conductive layers using laser-ablated connecting material.

A printed circuit board panel undergoes simultaneous component population and injection molding to form overmoulded optoelectronic sensors.

Segmenting flexible printed circuit boards into partial units enables precise positional alignment and efficient sheet layout.

Thermoplastic adhesive films join metallic components to housings through staged heating and pressing, preventing surface deformation from laser welding.

A Cu core ball coated with a solder layer maintains surface purity through controlled lightness parameters.

Integrating heating and interrogation functions into a single conductive piece simplifies manufacturing while ensuring homogeneous temperature control.

A 3D mounting device uses circuit patterns as reference positions to arrange components on complex surfaces.

A metal plating layer covers exposed copper foil surfaces on an elastic electric contact terminal to enhance soldering strength and environmental resistance.

A configurable substrate uses an interconnection matrix to link multiple SIP subsystems via programmable wire bonding.

A printed circuit board recess physically separates photoemitter and photodetector components to enable optical signal isolation.

A soldering flux combines two acrylic resins with distinct acid values to enhance printability and wettability.

Backplane printed circuit board establishes a dedicated ground channel to discharge high-frequency noise, resolving enclosure material constraints.

Capacitive readers detect embedded conductive patterns through the graphics layer, eliminating specialized scanning equipment for product tracking.

Electrically conductive adhesives seal through-electrodes within electronic device packages, resolving airtightness gaps caused by manufacturing variations.

An LED heat sink uses integral retaining portions to secure a circuit board without separate fasteners.

Pre-soldering battery leads to isolated nodes prevents voltage fluctuations during assembly, protecting sensitive circuit components from damage.

A wiring board uses a resin injection hole in the frame joining portion to fill gaps with sealing resin while maintaining electrical connections.

A circuit board with edge notches receives conducting wires to reduce soldering height and enable thin metal casing wrapping.

Flowing insulating adhesive into rough substrate openings creates a planar pad that eliminates wire connection failures and boosts manufacturing yield.

A storage device uses a retractable target object moving section to handle exchange targets across multiple placement sections.

Solid-state thermoelectric cooling replaces mechanical systems, improving power efficiency and reliability in power electronics.

Print and plate process eliminates subtractive etching steps to reduce copper waste and material costs while maintaining electrical conductivity.

Tapered via hole conductors reduce pitch in multilayer core boards to enhance electrical conductivity and power delivery speed.

Segmented adhesive patches secure embedded components while eliminating air gaps, internal stress, and moisture absorption risks during manufacturing.

A multilayer mounting bracket uses a dual-conductive polymer layer to dissipate heat and shield electromagnetic interference.

A mount head deactivation unit compares remaining parts against target counts to prevent mixing electronic components with different electrical characteristics.

Insulating films protect exposed conductive sections in this assembly, reducing manufacturing complexity and enhancing connection durability.