Hybrid Core Manufacturing for Warpage Control in Component Carriers
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Solution Overview
Problem
The miniaturization of component carriers and increasing electronic functionality lead to challenges such as warpage and manufacturing reliability issues, particularly due to the larger size of panels used in panel level packaging, necessitating innovative manufacturing approaches that balance yield, reliability, and cost efficiency.
Innovation Solution
The method involves embedding a carrier plate in a core to form a hybrid core, which allows for the formation of a stack with electrically conductive and insulating layer structures, enabling efficient manufacturing of component carriers with enhanced stability and precision, and the subsequent removal of the carrier plate to produce thin, reliable redistribution layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If panel level packaging is used to increase productivity, then manufacturing efficiency is improved, but warpage and reliability issues worsen due to larger panel size
Solution Approach 1:
The panel is divided into multiple smaller component carriers, each processed independently. This segmentation allows the large panel to be manufactured with high productivity while each small carrier maintains dimensional stability and avoids warpage, resolving the contradiction between manufacturing efficiency and reliability.
2Ease of manufacture
If panel size is increased to reduce costs, then manufacturing cost is improved, but warpage and manufacturing reliability worsen
Solution Approach 1:
The large panel is segmented into multiple smaller component carriers that can be processed simultaneously. This approach maintains the cost benefits of large-panel manufacturing while each segment remains small enough to avoid warpage and reliability issues, thus resolving the contradiction between manufacturing cost and reliability.
3Length of moving object
If miniaturization is pursued to reduce component size, then component dimensions are improved, but manufacturing precision and reliability worsen
Solution Approach 1:
The component carriers are pre-formed with precise dimensions and electrical connections before the actual electronic components are mounted. This preliminary action ensures that miniaturization is achieved with high precision in the carrier structure itself, while subsequent component mounting can proceed without compromising manufacturing precision, thus resolving the contradiction between component size and manufacturing precision.
Data Source
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AI summary
A method of manufacturing a component carrier (101) comprises: (i) embedding at least one carrier plate (120) in a core (111); (ii) forming a stack (102) on the at least one carrier plate (120), wherein the stack (102) comprises at least one electrically conductive layer structure (103) and/or at least one electrically insulating layer structure (104); (iii) thereafter removing the at least one carrier plate (120) from the stack (102). A corresponding hybrid core (110) and a corresponding semi-finished product (100) each comprise analogous features.